Electronics manufacturing: equipment, automation, software
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Showing 101-125 of 238 articles
Reflow soldering thermal profiling done in 30 min
Users of thermal profiling packages achieve an optimal thermal profile for high temperature reflow soldering after 30 min, compared with trial-and-error work with other systems.
News from Solderstar, Mar 29, 2006
Range of manual fine wire bonders
The Microelectronic Equipment Division of Inseto has introduced TPT's new range of manual fine wire bonders in the UK and Ireland.
News from Inseto (UK), Mar 23, 2006
Upgraded Web site informs on automation
Production automation specialist has upgraded its Web site to provide extensive product and case study information, arranged in a logical and user-friendly format.
News from Contax, Mar 22, 2006
Multi IC alignment tool speeds PCB assembly
With a novel 'Multi IC Alignment Tool' PCB assemblers can align the leads on a whole tube of ICs in one very simple action to increase the speed of PCB assembly.
News from Saturn Solutions, Mar 14, 2006
Selective soldering systems reduce defects
Two new selective soldering systems use dedicated drop-jet fluxing, which reduces the amount of flux at the point of soldering, so eliminating surplus flux on the PCB and reducing wastage.
News from Contax, Mar 3, 2006
Electronics catalogue and guidance goes on-line
Electronic components supplier has an on-line catalogue, which features a 'webgate' portal allowing access to Online Catalogue, Procurement with tracking system and Product Change Notifications.
News from Rutronik Elektronische Bauelemente, Feb 23, 2006
Electronics automation developments to be shown
Automation company will show equipment for small and medium volume manufacturers, from pick and place, through reflow and conveyoring to stencil printing and optical inspection at Nepcon.
News from Contax, Feb 17, 2006
Designate lead-free work areas with green stations
For electronic manufacturers grappling with RoHS compliance, green-coloured mats and tools are being used in separate lead-free areas to indicate a 'lead-free zone'.
News from Production Basics, Feb 17, 2006
Robot rides a bicycle perfectly
Murata has shown the sophistication of its electronic components by building an ingenious tiny robot that can ride a bicycle perfectly.
News from Murata Electronics (UK), Feb 13, 2006
Module 'flips' wafers in 90/180 deg orientations
Wafer flip module is designed for handling 300mm and 200mm wafers - in a 90 or 180 deg 'flipped' orientation - and is compatible with both edge grip and vacuum paddle end effectors.
News from Owens Design, Feb 13, 2006
Lead-free soldering equipment ordered
Simtek EMS who provides electronic manufacturing for industries including automotive, professional audio and satellite telemetry, has just ordered, from Kaisertech a range of JBC soldering equipment.
News from Kaisertech, Feb 13, 2006
Bill of materials conversion service is on-line
A source for RoHS compliant products and information, has launched an online version of its Bill of Materials conversion service - users log on and upload their BOM, regardless of the manufacturer.
News from Farnell InOne, Feb 6, 2006
Spray valve sprays coatings accurately
Having a a slim and long nozzle that can reach in between circuit board components a spray valve enables coating materials to be sprayed accurately and repeatedly without any over spray or mist.
News from Kaisertech, Feb 6, 2006
Slim bearings suit electronics manufacturing
A compact design, ability to withstand high temperatures, vacuum and chemical compatibility and low particulate generation make slim bearings ideal for use in semiconductor manufacturing.
News from Rodriguez (UK), Jan 27, 2006
Power spray cleaning units are solvent-free
Single chamber power spray units only rely on eco-friendly, odourless, solvent free, water-based detergents for stencils, PumpPrint stencils and solder frames.
News from Contax, Jan 26, 2006
Desoldering pump is compressed air driven
Compressed air driven desoldering pump allows two or four tools to be used at the same time and provide excellent engineering specifications control.
News from JBC Industrias, Jan 23, 2006
SMT production line ups capacity by 65%
Automation specialist has installed part of a new surface mount technology production line at a contract electronic manufacturer to increase the company's manufacturing capacity by over 65%.
News from Contax, Jan 12, 2006
Flexible chopshooter has high speed, accuracy
A range of mid- to high-volume SMD placers now features a chipshooter that provides high-speed, high-mix, high-accuracy production for applications such as automotive, memory boards.
News from Assembléon, Jan 9, 2006
Using lead-free connection technology
'Lead free PCB connection technology for your supply chain' will be a topic to be presented during the seminar programme at the forthcoming UK Southern Electronics Exhibition 2006.
News from Phoenix Contact, Dec 20, 2005
Linear motors operate under vacuum
The demand for linear motors that function reliably under vacuum conditions is growing rapidly among customers in the electronics and semiconductor industries.
News from Tecnotion BV, Dec 19, 2005
Tool offers atomic layer measurement accuracy
Metrology specialist, has unveiled an innovative nanotechnology weight metrology tool that offers atomic layer measurement accuracy and is designed to handle the demands of volume production.
News from Metryx, Dec 15, 2005
Board handling system is intelligent
An international electronic components manufacturer, has purchased a reflow oven and custom-designed board handling equipment to produce 1000 engine control units/day.
News from Contax, Dec 15, 2005
USB devices interface with LabVIEW
USB device for use with inter-integrated circuit and serial peripheral interface communication devices interface with LabVIEW to easily create programs to test, validate and program devices
News from National Instruments, Dec 13, 2005
Brochure available
Automatic wire bonders to be developed
Owens Design has partnered with Questar Products International to develop a product line of automatic wire bonders built on Kulicke and Soffa's former Hybrid bonder platforms.
News from Owens Design, Dec 12, 2005
Space-saving device protects against ESD
Surface-mountable varistors save space by replacing three components typically used to protect against transient voltage spikes: two back-to-back Zener diodes and an EMC capacitor in parallel.
News from AVX, Dec 5, 2005
Brochure available
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