Product category:
Electronics and Electrical Subcontracting Services
News Release from: 3M Speciality Materials
Edited by the Manufacturingtalk Editorial
Team on 09 April 2002
Dielectric fluid makes wafer fabrication
friendly
A new dielectric fluid for semiconductor heat transfer applications reduces the environmental impact of wafer fabrication processes without any compromise in performance or reliability.
A new dielectric fluid for semiconductor heat transfer applications has been introduced to the European market, by 3M Specialty Materials Division 3M Novec Engineered Fluid HFE-7500 has been developed as a long-term, practical, real-world solution addressing both performance needs and environmental concerns
This article was originally published on Manufacturingtalk on 26 Jun 2001 at 8.00am (UK)
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Hydrofluoroether-based HFE-7500 is a low global warming replacement for perflorocarbon (PFC) and perfluoropolyether (PFPE) fluids, reducing the environmental impact of wafer fabrication processes without any compromise in performance or reliability.
Its high dielectric strength reduces the risk of electrical discharge and will not damage the wafer or equipment in the event of a leak.
It is suitable for use with etchers, ion implanters, testers and other fab equipment.
With a global warming potential (GWP) some 50 times lower than comparable PFC and PFPEs, this is not an interim replacement product but a long-term sustainable solution, developed in consideration of both current and foreseeable environmental and safety regulations.
It is non-flammable, low in toxicity and has zero ozone depletion potential.
In response to its submission of information on HFE-7500 to the US Environmental Protection Agency, under its Clean Air Act Significant New Alternatives Policy (SNAP) Program, 3M was commended for developing effective replacements for high GWP chemicals and encouraged to continue its work in providing safe alternatives to ozone depleting substances and chemicals that contribute to global warming.
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