Product category:
Electronics manufacturing: equipment, automation, software
News Release from: Alliance Sales (Europe) | Subject: Neptco Wafertape range of dicing tapes
Edited by the Manufacturingtalk Editorial
Team on 06 June 2003
New range of wafer dicing tapes launched
A new range of wafer dicing tapes designed to assure consistent, precise and repeatable wafer production yields has been introduced to Europe by Alliance Sales (Europe).
A new range of wafer dicing tapes designed to assure consistent, precise and repeatable wafer production yields has been introduced to Europe by Alliance Sales (Europe) Neptco's Wafertape range of dicing tapes reduce silicon residues by applying superior coating technology that features Total Thickness Variation (TTV) control, an expandable base film plus a special low-extractable release liner
This article was originally published on Manufacturingtalk on 23 Sep 2002 at 8.00am (UK)
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Ideal for mounting wafers on a frame in preparation for dicing, the Wafertape dicing tape range is specially constructed using a PVC base film, pressure sensitive adhesive and a release film.
The benefits of using the Wafertape range include the consistent release of sawn die and an expandable base film.
The tapes are transparent which helps both human and electronic vision die defect recognition.
Wafertape's dicing tape range is available in the following standard widths: 200mm, 230mm, 250mm, 275mm, 300mm, 330mm and 400mm.
Custom widths can also be supplied.
Alliance Sales (Europe) is responsible for sales and technical support in the UK, Scandinavia and Finland of Neptco Incorporated's wide range of wafer dicing tapes for semiconductor industry applications.
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