Product category:
Electrical and Electronic Testing
News Release from: Alliance Sales (Europe) | Subject: Non contact semiconductor measurement tool
Edited by the Manufacturingtalk Editorial
Team on 12 February 2007
Non contact semiconductor measurement
tool
Alliance Sales has launched a fast, accurate and simple-to-use metrology tool which uses advanced weighing compensation algorithms to improve weighing accuracy.
A fast, accurate and simple-to-use metrology tool, which is based on innovative weighing technology, has been launched by the European Business Team The UK-developed Metryx Mentor tool uses software featuring advanced compensation algorithms to improve weighing accuracy by an order of magnitude compared with previous techniques
This article was originally published on Manufacturingtalk on 12 Feb 2007 at 8.00am (UK)
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Almost any process that results in a change in weight of a substrate will benefit from the tool.
Mass and density are fundamental properties of nearly all deposited materials used in the semiconductor industry.
Ideal for non-contact, non-destructive measurements on production wafers the Metryx Mentor tool can directly test or measure wafers.
The tool is capable of throughputs of 75 wafers per hour and can be shared with other metrology systems.
The Mentor offers fully automatic cassette-cassette operation using industry standard 200 and 300mm open cassettes to allow measurements of the wafers before and after processing.
Control of ambient conditions is fully automatic to provide a weighing capability to the required level of <0.04mg needed to detect density changes in the range of 0.01g/cm3.
The tool is sensitive enough to distinguish k variations from small changes in deposition parameters.
For metal film applications the system can measure thicknesses down to atomic resolution levels for barrier layers.
The tool can also determine the anneal state in Copper films not detectable by other methods.
The tool is controlled via an SVGA Touchscreen with simple-to-use software that can be fully integrated to any fab communications network using SECSII/GEM.
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