Product category:
Measurement and Quality Software and SPC
News Release from: Ansoft Europe | Subject: Q3D Extractor v6
Edited by the Manufacturingtalk Editorial
Team on 05 March 2004
Design Of High-Performance Interconnect
Quickened
Ansoft Corporation has announced the release of Q3D Extractor v6, the next generation of 3D parasitic extraction technology.
Q3D Extractor speeds the design of critical nets and interconnect components in integrated circuit (IC) packages (i.e, leads, bond wires), on printed circuit boards (PCBs) and in the connection path between them (i.e, connectors, cables, sockets, transmission lines) This release, complemented by Ansoft Designer, Nexxim and HFSS, launches a new electromagnetic (EM)-based design synthesis solution for on-chip passives in high-performance ICs where structures such as spirals, vias, meanders and interdigitated capacitors must be designed and optimized up front to achieve first-pass timing closure
This article was originally published on Manufacturingtalk on 27 Apr 2007 at 8.00am (UK)
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Andrew Byers, Senior Electrical Engineer at Tektronix, says, "A board, package or IC that fails to perform as expected can create cost overruns and large delays in time-to-market.
We use Q3D Extractor early in the design process to accurately model critical components, which helps us avoid costly design turns and, therefore, get to market sooner." Q3D Extractor v6 features the Ansoft Desktop, an intuitive, easy-to-use, design environment already familiar to HFSS v9 and Ansoft Designer customers.
The new environment seamlessly integrates all electromagnetic-field simulations required for the extraction of 3D RLC parameters and automatically generates equivalent circuit models.
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Designers can use this EM-based equivalent circuit to accurately perform signal-integrity investigations into crosstalk, ground bounce, interconnect delays, ringing and reflections.
"This new EM-based design synthesis solution for on-chip 3D passives starting with Q3D Extractor offers the most precise design flow available," said Dr Zoltan Cendes, Ansoft's Chairman and Chief Technology Officer.
"The integration of Q3D Extractor within the Ansoft Desktop enables co-simulation of Q3D Extractor with Ansoft Designer, Nexxim and HFSS and moves Ansoft further along in its strategy to bring EM-based precision upstream in the electronic-design process." Q3D Extractor highlights include: * Fast capacitance, DC inductance and resistance and AC inductance and resistance computation * SPICE exports of computed RLC parameters as netlists (subcircuits) for use in HSpice, PSpice, Ansoft Designer, Nexxim and SIMPLORER.
* Cadence DML files, IBIS.PKG file export * Ansoft's next-generation desktop architecture, featuring the look and feel of Microsoft Windows * Dynamic parameterized link with Ansoft Designer and Nexxim * Integrated parametric sweeps, sensitivity, statistical analysis and optimization capability * Parametric user-defined primitives (UDPs) for customized on-chip passive geometries/library of parts * Scripting, using a standard scripting language (Visual Basic) * Visual displays of AC and DC current distributions and surface charge distributions on conductors * True 3D solid modeling based on the ACIS modeling kernel * Ability to import Cadence, Mentor, Graphics, Synopsys and Zuken layout information using AnsoftLinks Availability Q3D Extractor v6 will be available for general commercial release in March 2004.
The release will support the following operating systems: Windows 2000, Windows XP, Solaris 2.8+ and HPUX 11.0+.
Note: Spicelink is the predecessor product of Q3D Extractor.
If you are currently a Spicelink user, please contact your nearest Ansoft sales office to discuss migrating your Spicelink software to this new product release.
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