Product category:
Measurement and Quality Software and SPC
News Release from: Ansoft Europe | Subject: Turbo Package Analyzer (TPA) v4.2
Edited by the Manufacturingtalk Editorial
Team on 15 July 2005
IC package accurately characterise
designs
Ansoft has announces Turbo Package Analyzer (TPA) v4.2 that combines new bidirectional integration with Ansoft's state-of-the-art 3D electromagnetic simulation.
Ansoft has announces Turbo Package Analyzer (TPA) v4.2 that combines new bidirectional integration with Synopsys' Encore package-design software with Ansoft's state-of-the-art 3D electromagnetic simulation It enables full parasitic extraction of complex IC packages, such as ball-grid arrays (BGAs)
This article was originally published on Manufacturingtalk on 1 Dec 2003 at 8.00am (UK)
Related stories
Ansoft Releases SIMPLORER v6.0 Service Pack 4
Ansoft announces Service Pack 4 for SIMPLORER, the company's multi-domain electromechanical system simulation software.
New Release Features Solver on Demand
New Release Features Solver on Demand with Nexxim and Q3D Extractor to provide the most complete RF/mixed-signal IC design solution available today
"As a result of our close collaboration, Ansoft's advanced electromagnetic technology for package extraction and characterisation can be accessed directly from our Encore product today," said Kevin Rinebold, Synopsys' senior technical marketing manager, Packaging Products.
"Our work with Ansoft further advances the state of the art in package planning and design by integrating Ansoft's latest capabilities with our IC/Package co-design environment." With AnsoftLinks, a tool for simplifying data import and export between EDA and CAD packages, TPA v4.2 will generate resistance, inductance and capacitance (RLC) models directly from popular package design tools.
It accepts CAD data and fully characterises the entire package in three dimensions.
The 3D analysis provided by the TPA v4.2 extraction engine can solve any BGA package structure, including wirebonds, pads, vias, tapered traces, solder balls and non-ideal power and ground structures.
For crosstalk simulations, TPA v4.2 automatically provides a multi-conductor coupled RLC model for each lead in the package.
The user specifies the number of nearby (adjacent) leads for coupling, and the program automatically calculates all of the parasitics.
• Ansoft Europe: contact details and other news
• Email this article to a colleague
• Register for the free Manufacturingtalk email newsletter
• Manufacturingtalk Home Page
Search the Pro-Talk network of sites
