Product category:
Measurement and Quality Software and SPC
News Release from: Ansoft Europe | Subject: SIwave v3
Edited by the Manufacturingtalk Editorial
Team on 16 August 2005
Full-wave electromagnetic-field
simulator
SIwave v3 from Ansoft is a full-wave electromagnetic-field simulator optimized for signal- and power-integrity analysis of high-performance printed circuit boards and integrated circuit packages.
Ansoft has released SIwave v3, a full-wave electromagnetic-field simulator optimized for signal- and power-integrity analysis of high-performance printed circuit boards (PCBs) and integrated circuit (IC) packages The new version provides expanded analysis capabilities for board and package co-design and EMI/EMC studies
This article was originally published on Manufacturingtalk on 27 Apr 2007 at 8.00am (UK)
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Customers in the computer, semiconductor, networking, communications and high-performance consumer electronics industries benefit from the new release as it broadens the scope of simulation, more closely realizes the complete system configuration and ultimately saves design time and cost as design re-spins are reduced.
Package and Board Co-Design SIwave's full-wave, finite-element technique allows designers to characterize simultaneous switching noise (SSN), inter-symbol interference (ISI), power and ground bounce, resonances, reflections and coupling between traces and power/ground planes across the package and through the board.
With the inclusion of enhanced via modelling and package/board co-simulation, engineers are now able to more accurately characterize the entire PCB populated with IC packages.
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Ansoft has announced the Turbo Package analyser (TPA) v5.
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New automation features streamline model and simulation set-up while providing the necessary flexibility to readily analyze complex PCBs within SIwave.
Additionally, for chip-to-chip channel analysis, the new dynamic-link capability to Nexxim, Ansoft's next-generation, high-capacity circuit simulator, supports direct frequency- and time-domain analysis with IBIS or transistor-level accuracy from within Ansoft Designer or DesignerSI.
EMI/EMC Analysis Far- and near-field data from SIwave can now be imported as a source driving HFSS v10, the industry-standard tool for 3D full-wave electromagnetic modelling.
Imported fields can be from a previously solved project, or SIwave can be launched directly from HFSS v10 to run an analysis and provide extracted data.
For example, SIwave and HFSS can now be combined to predict the electromagnetic radiation contained within, or escaping from, an enclosed space, such as computer housing related to the operation of high-speed complex PCBs.
Additional Highlights of SIwave v3 include: Package and board co-simulation Dynamic link to HFSS for EMI/EMC Dynamic link to Ansoft Designer, DesignerSI and Nexxim for transistor-level and/or IBIS driver/receiver co-simulation Enhanced via modeling for greater accuracy of overall channel characterization Robust interpolating discrete sweep supporting fast frequency analysis RLGC extraction from S-parameters Pin grouping and automatic port generation Increased memory efficiency for solving larger problems Improved low-frequency characterization Enhanced DC resistance calculation Enhanced cavity-to-cavity resistive coupling.
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