Product category:
Electronics manufacturing: equipment, automation, software
News Release from: Assembléon | Subject: ACM SemiconD-9
Edited by the Manufacturingtalk Editorial
Team on 19 September 2002
Higher accuracy in semiconductor
placement
Assembleon is launching a new semiconductor component placement machine which delivers high speed and accuracy for applications involving tight tolerances and critical handling restrictions
Assembleon is launching a new semiconductor component placement machine which delivers an unbeatable speed/accuracy combination for applications involving tight tolerances and critical handling restrictions One of foremost players in SMT component placement, Assembleon has seen component dimensions rapidly reduce as cost considerations have driven the electronics manufacturing industry towards assembly of flip chips, bare dies and chip-scale packages
This article was originally published on Manufacturingtalk on 27 Jan 2003 at 8.00am (UK)
Related stories
Twin tape feeder ups chipshooter machines
An innovative twin tape feeder, using dual tape single slot technology, enables the user to increase 8mm SMD tape component part numbers on Assembleon machines.
Many developments feature board assembly machines
Important new features, some debuted at APEX 2004, further enhance the flexibility of a proven range of entry-level to medium-volume pick-and-place machines.
Because parallel trends in the semiconductor industry now see manufacturers here assembling a variety of GaAs, optical, silicon and chip components on a common substrate, Assembleon is able to introduce the D-9 component mounter for this sector based on technology already proven in the SMT marketintroduces a new version of its Advanced Component Mounter (ACM) specifically dedicated to this sector.
A combination of accuracy, speed and versatility makes the ACM D-9 Semicon the platform of choice for a wide range of applications including stacked die, multi-chip modules, multi-chip packages, flip chip in package, flip chip on foil, flip chip on board, and high-accuracy optical component placement.
Based on state-of-the-art linear motor technology, touchscreen display, and modular design, Assembleon's technology the ACM has proved a strong contender in the SMT market and is now making a natural progression to the semicon industry, where it provides verified placement throughput of 2700 flip chips per hour with 9 micron accuracy at 3 sigma, delivering performance which is unprecedented in this sector.
Further reading
PCB assembly line scores, second ordered
Canadian contract electronics manufacturer has made such an impact on its specialist market in complex PCBs that it installed a second production assembly line just two months after the first.
Multifunctional SMD placement is very flexible
Multifunctional SMD placement machine brings unprecedented flexibility for SMT component parallel placement technology to mid- to high-volume high-mix market segments.
Placement machine achieves perfect balance
Placement machine delivers the perfect balance between high mix and high accuracy, meeting production requirements in all sectors of the mid-volume SMT market.
With capability for handling a wide range of hybrid fabrication applications combining flip chips and bare dies with passive components, the ACM SemiconD-9 is ideal for the packaging and module markets.
The machine accommodates up to 75 different components simultaneously, with dimensions ranging from 0.3 to 44mm square and with a vision system which can recognise ball sizes down to 70 micron.
Advanced closed-loop z-axis design provides controlled placement forces from 0.9 to 40N, or fixed placement forces from 0.06N, ideal for fragile GaAs products.
The ACM SemiconD-9 accepts numerous feeder options, including tape and reel, surftape, waffle pack, direct wafer and gel pack, and supports a wide variety of substrates including FR4, flexfoils, boats, ceramics, leadframes, carriers, and so on.
An integrated flux dipping unit, depositing a flux layer from 20 to 120 micron in thickness, is an option.
Also optional is direct wafer feeding capability handling wafer sizes from 100 to 300mm (four to 12 inches), and die sizes from 0.5 to 25mm square.
This facility accommodates up to 25 unique part numbers, with automatic wafer change and wafer expansion, adjustable anvil, and further options such as a die flipping unit, barcode reader and wafer mapping.
In order to address the semiconductor market, the ACM SemiconD-9 is Assembleon's first venture into cleanroom compatibility, with Class 1000 and SEMI S2/S8 compliance.
The machine features a Windows NT-based GUI for ease of use, and is compatible with the SECS/GEM production management system interface.
The ACM SemiconD-9 is backed by comprehensive line engineering, set-up, ramp-up and production support worldwide.
(This was Manufacturingtalk's Top Story on 18 September 2002).
• Assembléon: contact details and other news
• Email this article to a colleague
• Register for the free Manufacturingtalk email newsletter
• Manufacturingtalk Home Page
Search the Pro-Talk network of sites
