Product category:
Electrical and Electronic Testing
News Release from: Atek Technology | Subject: Probes, Ceramic And Metal Packages
Edited by the Manufacturingtalk Editorial
Team on 25 June 2003
More Specialist Probes, Ceramic And
Metal Packages
A number of specialist test probes and receptacles for use in loaded and bare boards as well as in industrial and pneumatic applications has been introduced by ATEK Technology.
A number of specialist test probes and receptacles for use in loaded and bare boards as well as in industrial and pneumatic applications has been introduced by ATEK Technology Offered alongside new, high performance semiconductor packages in ceramic and metal, these high performance, high specification products are the direct result of the ATEK product sourcing service
This article was originally published on Manufacturingtalk on 26 Feb 2003 at 8.00am (UK)
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Designed for use in wafer and hybrid test applications, the ATEK Technology range of probe needles offers high electrical conductivity and flexural strength as well as corrosion and wear resistance.
A New, Unbiased Source For Test Engineers
Offering a wide variety of quality spring loaded test probes and receptacles from the best manufacturers, the ATEK Technology range includes industrial, pneumatic, coax and standard ATE versions.
Designed to solve the problems associated with those "hard to find" products, the ATEK product sourcing service is free of charge and reflects ATEK's specialist experience of more than 30 years in electronics materials and piece parts.
Special tipped probes, including non-rotating blades for testing connector blocks and multiple tipped probes which allow a larger range of tolerances on the test pad, are an example of the specialist probes that are available.
Co-axial probes for higher frequency applications are also popular as they allow the testing and set up of RF circuits prior to final assembly.
A combination of tip style and travel with carefully controlled spring forces has also resulted in a number of successful applications in the automotive area.
Utilising the latest in ceramic design and lightweight, high thermal packaging concepts along with conventional glass to metal seal technology, the ATEK range of cost effective ceramic and metal packages can be produced quickly and efficiently.
Meeting the needs of high power semiconductor, microelectronic and high speed communications applications, they are ideal for use in fibre optic communications, launchers, detectors and other active systems, high power devices and hybrid systems.
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