Product category:
Non-contact, Optical and Laser
News Release from: Armstrong Optical | Subject: Fused silica wafers
Edited by the Manufacturingtalk Editorial
Team on 14 February 2005
Fused silica wafers added
Armstrong Optical now includes a series of fused silica wafers in its offering, ideal substrates for many applications.
Now available from Armstrong Optical , Northampton are fused silica wafers Standard wafer diameters include 100mm, 150mm and 200mm and are delivered in less than 2 weeks
Wafers down to 0.5mm in thickness are processed on double-sided polishers with under 10 seconds of wedge and transmitted wavefront error of under one wave.
Stock wafer blank material is Corning 7980 Fused Silica, but wafers can also be produced from Heraeus Amersil and Schott Lithotec fused silica as well as other materials such as Borafloat, BK-7 and B270.
Wafers with different diameters, thickness and locating flats are also available, as are wire-sawn wafer blanks.
These wafers are ideal substrates for all WDWM, MEMS/MOEMS and chrome-on-glass mask manufacturing applications.
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