Product category:
Non-contact, Optical and Laser
News Release from: Armstrong Optical | Subject: IR108 thermal sensor modules
Edited by the Manufacturingtalk Editorial
Team on 23 August 2005
40% more pixels for thermal sensor
module range
New IR112 thermal sensor modules from Armstrong offer users the ability to use 40% more pixels for 8 - 14 microns infrared imaging applications.
Similar in size to the IR108 thermal sensor modules from Armstrong Optical of Northampton, the new IR112 thermal sensor module offers users the ability to use 40% more pixels for 8 - 14 microns infrared imaging applications Based around a 384 x 288 pixel array of 35microns square pixels fabricated from amorphous silicon, the uncooled microbolometer array has been designed for easy integration into 3rd party thermal imaging camera systems
This article was originally published on Manufacturingtalk on 6 Dec 2004 at 8.00am (UK)
Related stories
Gauge block calibration system
The EPP 01 Gauge Block Calibration System can not only yield faster, more accurate results (+/-10nm) but also lower to ~15 the number of gauge blocks needed to calibrate a 122 block set.
Once again the sensor array module is truly plug-n-play with standard video output (PAL/NTSC) complimented by built-in FireWire 1394; gain, offset, zoom, brightness, contrast and image display are all available through standard interfaces increasing the versatility of this thermal sensor module.
The IR112 represents the latest of the new thermal imaging products available from Armstrong Optical - including a fully radiometric system the size of a mobile phone (the MobIR M4) and a new top-of-the-range hand-held system for Predictive/preventive maintenance applications (the IR928+).
• Armstrong Optical: contact details and other news
• Email this article to a colleague
• Register for the free Manufacturingtalk email newsletter
• Manufacturingtalk Home Page
Search the Pro-Talk network of sites
