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Product category: General packaging materials, equipment and services
News Release from: CorinTech | Subject: wire bonder
Edited by the Manufacturingtalk Editorial Team on 05 March 2007

Corintech sets the pace with new wire
bonder

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Setting the pace when in the pursuit of quality, performance and perfection is an ideal Corintech, the UK's leading independent micropackaging company, firmly believes in.

Setting the pace when in the pursuit of quality, performance and perfection is an ideal Corintech, the UK's leading independent micropackaging company, firmly believes in The company knows that only the very best solutions are acceptable to its clients, so it works hard to maintain a competitive advantage to help its clients succeed in their own marketplaces

Corintech is leading the field once more, setting the pace with one of its latest investments, an AB 530A ultrasonic wedge bonder from ASM Industries.

The newly installed bonder has outstanding machine performance, which greatly enhances Corintech's wire-bonding capabilities, and provides new productivity solutions to clients' requirements.

Bonding speed of 8 wires a second are met while maintaining accurate fine pitch to 68um, as well as the ability to achieve excellent small bond pad handling.

This new installation continues Corintech's programme of planned capital expenditure at its Hampshire-based design and manufacturing facility.

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