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Product category: Electronics manufacturing: quality control equipment, software
News Release from: Contax | Subject: X-ray inspection system
Edited by the Manufacturingtalk Editorial Team on 04 April 2007

X-ray solder inspection system with
software

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X-ray inspection system with inspection software, produced by Phoenix and available through Contax, is ideal for manual and automatic solder joint inspection.

Phoenix x-ray's micromex X-ray inspection system offers inspection software and quality assurance Available exclusive from Contax in the UK and Ireland, micromex is a submicron high-resolution system for manual and automatic solder joint inspection

This includes automatic x-ray inspection of PCB assemblies such as BGAs, CSPs, MLFs and QFPs.

The microme|x uses an integrated 2 Megapixel camera, so exceeding the existing standard of 1,3 Megapixels.

This, combined with the open 160kV or 180kV submicron X-ray tube, enables detailed analysis with a resolution of <1um as well as a total magnification up to 13.300x.

The micromex offers highly precise manipulation with a 360 degree rotation axis and the approved technology for oblique views of up to 70 degrees.

The scanning area has a size of 4572 mm x 3556 mm (18 inches x14 inches).

This enables samples up to 680 mm x 635 mm and up to 5kg in weight, to be inspected without problems.

The new quality assurance software was designed to offer ease of use, together with many-sided fully digital image processing.

In addition, the powerful algorithm toolbox XE offers the best solution for application testing.

"The micromex is an ideal system for solder joint inspection in any production or laboratory environment", said Mike Rapson, Managing Director at Contax .

"In addition to the system's high performance capabilities, it features a board handling facility for the automated loading of assembled boards.

This enables multiple inspection tasks to be carried out and repeated in an easy, reliable and time-saving manner", he said.

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