Product category:
Electronics manufacturing: quality control equipment, software
News Release from: Dima SMT Systems NL | Subject: WEEE directive compliance
Edited by the Manufacturingtalk Editorial
Team on 03 March 2006
Meeting WEEE directive compliance
By 1st July 2006, companies selling electronics products to the European Union nations and China must ensure that their products and components comply with the WEEE directive.
By 1st July 2006, companies selling electronics products to the European Union nations and China must ensure that their products and components comply with the WEEE directive By 1st July 2006, companies selling electronics products to the European Union nations and China must ensure that their products and components comply with the Waste Electrical and Electronic Equipment (WEEE) directive in order to stay on the Single Market This directive aims to minimise the impacts of electrical and electronic equipment on the environment during their life times and when they become waste
This article was originally published on Manufacturingtalk on 30 Dec 2005 at 8.00am (UK)
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This means the manufacturers of electronic products will have to convert to a lead-free manufacturing process.
Lead containing solders have been used as an interconnecting and surface coating material in various electrical and electronic applications for decades.
The main driving forces that affect current and future requirements of solders for electronic applications are the demand on the level of performance and the concern over health hazards of lead.
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The latter concern had lead to government legislation and regulations that have continued to impact the future use of lead.
Lead and its compounds have been rated as one of the top 17 chemicals that impose the greatest threat to human health.
Slowly but surely time is running out and decisions need to be made.
Over the last years many companies have been confronted with investments needed to be able to have their production switched over to Lead Free before the deadline of July 1st.
Ever since the introduction of the Lead Free solder paste the question has been; How advanced should a reflow oven be? The success of a reflow oven is not measured in its size or the amount of heating zones, it is determined by the ability to create every possible reflow profile.
A simple calculation will help to explain what is needed.
For most lead-free reflow profiles the board needs about three to five minutes in the process chambers.
For those companies that produce only small batches of boards the speed of the conveyor is of no big importance.
Therefore if the oven runs at 20cm per minute a tunnel length of maximum 100cm (20cm x 5min) is required, or if the oven runs at 40cm per minute a tunnel length of maximum 200cm (40cm x 5min) is required.
The amount of zones is a similar story.
The high throughput ovens are using many zones, but in practice several zones are set at the same temperature.
Dividing one long zone into several smaller zones makes it easier to keep the temperature uniform over a longer distance.
In theory only three zones plus one cooling zone is required (ramp-soak-peak), but in practice it is easier to create an ideal profile when adding one extra heating zone.
Both DIMA's Breeze and Solano offer a powerful convection heating irrespective of the size and mass of the components.
The unlimited variation of temperature profiles is achieved by the tunnel designs that includes 4 top heating and 4 bottom heating zones.
To eliminate the possibility of damage caused by static, the Breeze and Solano include an air ioniser in the cool down zone as standard equipment.
The Breeze and Solano reflow oven offer full forced hot air heating to maintain consistent edge-to-edge temperatures, regardless of component size or density.
DIMA SMT Systems also manufactures a full range of stand-alone and in-line systems for the SMT industry like stencil printers, pick and place systems selective conformal coating systems and dispensing systems.
DIMA SMT Systems offers applications development support at no charge.
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