Product category:
Electronics manufacturing: equipment, automation, software
News Release from: Dima SMT Systems NL | Subject: Hybrid Pick and Place Systems
Edited by the Manufacturingtalk Editorial
Team on 19 April 2006
Pick and place unit handles 0201
components
An upgrade for hybrid pick and place systems make them capable of handling 0201 components utilising a new feeder which has much better and more accurate index steps.
Striving to have to most flexible and accurate Pick and Place machine available in its range, DIMA is proud to announce the successful upgrade for their Hybrid Pick and Place Systems making it capable to handle 0201 components Being able to handle as many different components shapes and sizes available in today's market has always been the challenge for the DIMA Hybrid Pick and Place machines
This article was originally published on Manufacturingtalk on 30 Dec 2005 at 8.00am (UK)
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Especially for those companies that have small to medium production series of many different kind of PCBs a flexible Pick and Place machine is a must.
Not only short changeover times but also the capability to handle almost every available component is important.
The Hybrid Pick and Place machine could already handle components ranging as small as 0402 up to 42 x 42mm large components.
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Even 16mm high components and 0.4mm fine pitch components are being handled without problems.
By introducing a special feeder and pick up tool the Hybrid Pick and Place is now capable of accurately handling 0201 components.
Handling the 0201 component introduces a few new issues into a pick and place machine.
The smaller dimension and lower mass of an 0201-device compared even to its 0402-cousin hold the key to the likely increase in defect rates.
Because the nozzle is almost the same size as the component, there is a higher probability of miss-picking the component from the paper tape.
Moreover, the components can also move significantly, relative to their size, in the tape, unless the tolerance between the pocket dimensions and part dimensions are tightened.
Also, electrostatic effects resulting from separating the cover foil from the paper tape have a greater tendency to displace the lightweight components before it can be picked.
Finally since the smaller component dimensions allow closer spacing on the PCB, placement resolution must be almost twice as high for 0201s as for 0402s.
DIMA has succeeded in overcoming all these points of attention for the Hybrid Pick and Place machine utilising a new feeder that uses the same body as a standard 8mm feeder but with much better and more accurate index steps.
Compared to the standard 8mm feeder this new feeder uses 6 times more micro steps with a step repeatability of 30 micron.
Furthermore a special pick up tool has been developed to accurately pick up and place the 0201 component allowing interspacing of 150 micron.
Integration of this new feeder and tool will be possible not only on a new Hybrid Pick and Place machine, but DIMA also offers the possibility to upgrade all the Hybrid Pick and Place machine of their existing customers.
During Nepcon 2006 in Birmingham, UK (May 9 - 11) and during SMT 2006 in Nuernberg (Nuremberg), Germany (May 30 - June 1), DIMA SMT Systems will live demonstrate the new Hybrid Pick and Place capabilities.
DIMA SMT Systems also manufactures a full range of stand-alone and in-line systems for the SMT industry like stencil printers, reflow, curing and drying ovens, selective Conformal coating systems and dispensing systems.
DIMA SMT Systems offers applications development support at no charge.
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