DSM introduces Xantar for LDS applications

A DSM Engineering Plastics product story

Edited by the Manufacturingtalk editorial team Dec 4, 2008

DSM Engineering Plastics has introduced a grade of Xantar LDS PC/ABS that is suitable for Laser Direct Structuring (LDS) applications.

Xantar LDS 3710 was developed for antennas in mobile telecom products such as telephones, PDAs and other applications where integrated circuitry is used to replace traditional printed circuit boards.

A key application for Xantar LDS 3710 is the GSM antenna for a mobile phone.

Produced by Molex, this is the first time DSM's PC/ABS-based LDS technology has been used for production of a mobile phone antenna.

The antenna function is made by means of Laser Direct Structuring on a moulded part.

LDS is a simple and precise technology for producing 3D-moulded interconnects.

After moulding, the interconnect pattern is directly written on the part and the conductive paths are plated where the plastic has been activated by the laser.

The part is subsequently fixed in the housing of the mobile phone.

Laser Direct Structuring offers flexibility, real 3D-shaped circuitry on a plastic moulded part and design freedom.

DSM said that Xantar LDS 3710 provides excellent plating properties, excellent ductility and high impact performance.