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News Release from: DuPont (UK) | Subject: Tyvek
Edited by the Manufacturingtalk Editorial
Team on 26 July 2005
Tough Tag Substrate for RFID On Show At
Labelexpo
DuPont will be presenting its tag and label end uses applications based on Tyvek, a non-woven polyethylene-based material, at Labelexpo.
DuPont will be presenting its tag and label end uses applications based on Tyvek, a non-woven polyethylene-based material, at Labelexpo Tyvek is claimed to provide a sturdy, tough and tear resistant substrate for tags and labels, suitable for the latest RFID (Radio Frequency Identification) technology tags, beleives the company
This article was originally published on Manufacturingtalk on 2 Mar 2005 at 8.00am (UK)
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DuPont, in cooperation with equipment manufacturer Melzer Maschinenbau, a manufacturer of RFID tag producing equipment will be presenting their fully-automated manufacturing process for the smart labels utilising DuPont Tyvek as the tag substrate at Labelexpo in Hall 6 - Stand 6G10.
Demonstrations will feature transponders made by KSW Microtec of Germany and fitted with microchips and antennae.
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The transponders will be fixed to rolls of Tyvek, which will then be made in to RFID labels.
Thanks to its resistance to tears, puncturing and abrasion, as well as to harsh weather conditions and chemicals, the Tyvek substrate is claimed to offer long-lasting protection for both the transponder and the chip data it contains, even in the harshest conditions, claimed DuPont.
Tyvek is also said to offer print quality that is just as good as paper but, due to its sturdiness and protective properties, it offers long-lasting protection for RFID technology on labels, tags and tickets.
DuPont added that trials with reputable manufacturers of smart label production equipment, such as Melzer and Bielomatik, have shown that Tyvek is a highly certified compatible substrate suitable for RFID technology production equipment.
For example, Tyvek and Tyvek Brillion - a type grade with a particularly smooth surface for thermal transfer printing - have been certified by Melzer for processing with its single-lane Melzer RFID SL-L100 machinery for smart labels as well as for the four-lane ST-L400 machinery for smart tags and tickets.
Long-term trials even in the harshest conditions have confirmed that Tyvek provides long-lasting protection for chips and antennae in RFID tags and labels.
A further claimed advantage of Tyvek in the automated processing of RFID products is that the non-woven material undergoes an anti-static treatment during production.
Risks of damage or destruction of the sensitive RFID electronic chip components by static are, therefore, eliminated from the RFID tag production process from the outset, thus increasing production yields.
The Melzer equipment additionally has an integrated in-line inspection system for the transponders.
That ensures that only properly functioning transponders are used and 100 per cent of RFID tags, labels and tickets coming off the assembly line have been tested.
The types of Tyvek used in the manufacture of RFID products have a weight per unit area of 75gsm - 105gsm, depending on their end use.
Tyvek is available in a self-adhesive format surface, so that the polyester film used to apply the transponders to the substrate does not necessarily have to be self-adhesive.
Added to which an RFID ticket or tag can be subsequently printed without a problem.
The material is also claimed to be suitable for most printing processes including four-colour offset, thermal transfer and some digital printing techniques.
Should a finished RFID product need to be printed on later, that is possible using a thermal transfer print procedure.
The DuPont stand at Labelexpo will be 12X60 in hall 12.
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