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News Release from: Engis (UK)
Edited by the Manufacturingtalk Editorial
Team on 03 December 2003
Superabrasives provider sets up hi-tech
UK base
Providing products and services in diamond flat lapping and polishing, mould finishing and tool room products, a diamond and superabrasives systems provider is strengthening UK operations.
Global diamond and superabrasives systems provider, Engis Corporation, is putting the finishing touches to its strengthened UK operation Engis has built a world-wide reputation for excellence in the manufacture of superabrasive finishing systems for manufacturing operations that demand precision surface polishing and close tolerance requirements
This article was originally published on Manufacturingtalk on 8 Jan 2001 at 8.00am (UK)
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In particular, the company provides technology-leading products and services in areas including diamond flat lapping and polishing, mould finishing and tool room products.
As the result of major advances in new finishing techniques developed at its parent site in Chicago and at manufacturing facilities in Japan and South Korea, the Engis Corporation has entered a new phase of expansion into the nanotechnology and micro-manufacture arena.
Europe, and the UK in particular, is seen as a key market for these leading-edge products because of its strength in emerging technologies.
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Diamond compounds provide more surface coverage
Diamond compounds, specifically designed for mould polishing, provide more surface coverage and improved impregnation of lapping tools. The products are also oil soluble.
One-stop lapping and polishing consumables shop
Engis (UK is now able to offer customers a one-stop shop for high quality lapping and polishing supply solutions.
These new opportunities created the need for change in Engis' UK business structure.
MD, John Wellings, was appointed in early 2002, bringing with him a wealth of manufacturing experience as well as extensive knowledge of the Engis corporation and its products.
John made the decision to relocate the company to new, high tech facilities in Henley-on-Thames, which has excellent transport links to both the South Midlands manufacturing base and the academic and research establishments near Oxford.
The physical move brought with it the opportunity to update the business infrastructure, including installing IT facilities to improve customer support and inventory management.
A new professional sales team with specialist skills was put in place to support Engis' highly technical customers in their use of the new and extended range of products: Paul Kingscott has extensive knowledge of lapping technology while Mark Foster has a background in diamond technology and engineering.
Wellings is delighted with the impact that the newly refreshed and re-focused Engis (UK) company has already made.
"We've put together a really strong team, with the necessary infrastructure to deliver market-leading products to the customers.
Naturally, the development of Engis (UK) is ongoing and we are currently completing a project to install an on-site process development laboratory at the Henley facility, concentrating particularly on wafer processing and precision bore finishing." The strengthened UK operation is currently launching the new HYPREZR DiaMoldR range of compounds specifically designed for mould polishing, which the company believes is truly best of breed in terms not only of technology but also in terms of best value.
Engis has cut through the bewildering array of polishing compounds available by refining its mould and die polishing compound products to a range of eight clearly differentiated products, each specifically designed for optimum performance on a particular task.
In addition, the company continues to develop and market non-diamond products providing solutions to other surface finishing requirements in application areas such as precision optics and opthalmics.
The technology which Engis has at its disposal can be used in many applications, one of the most recent being, enhanced CMP lapping slurries.
Wellings notes "This is a particularly exciting area where our new CMP with Diamond (CMP-D) is particularly suitable for more inert wafer materials.
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