Cerium oxide polish avoids 'sleeking' damage

Cerium oxide polish characteristics ensure that even when the slurry has settled, it does not have a tendency to cake or form hard agglomerated 'clumps', which could scratch polished items.

Extensive Research and Development has led to the launch of a new soft-settling, premium grade, Cerium Oxide polish, Unicer 636, which can enhance productivity while cutting machine maintenance downtime, and reducing the possibility of 'sleeking'.

The special characteristics of Unicer 636 mean that even when the slurry has settled, it does not have a tendency to cake or form hard agglomerated 'clumps', which could cause 'sleeks' or scratches across items being polished.

In addition to easing the flow through nozzles and plumbing, the soft-settling nature of Unicer 636 also reduces machine cleaning and therefore maintenance requirement.

The product, seen for the first time at the Photonex exhibition, is suitable for both high and low speed polishing in optics applications, on a wide range of materials including BK7, quartz, borosilicate, Zerodure and fused silica.

The closely controlled particle-size distribution, combined with an average particle size of 0.6 - 0.7 micron, provides a high quality surface finish suitable for even the most stringent of applications.

Unicer 636 performs well across a wide range of speeds, pressures and pad materials, including filled and un-filled polyurethanes, woven and napped pad materials, as well as pitch, making it a universal polish.

With a high content of chemical components designed for rapid stock removal, and a superior suspension system, Unicer 636 offers customers significant productivity and ease-of-use benefits including fast polishing speed and superior lifetime performance.

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