Product category:
Polishing, buffing and surface texturing
News Release from: Engis (UK) | Subject: Polishing of ultra-hard materials
Edited by the Manufacturingtalk Editorial
Team on 16 June 2006
Ultra-hard materials polishing times
reduced
Extensive R and D activity into the polishing of ultra-hard materials including silicon carbide and sapphire has reduced sapphire processing times using composite plate and CMP-D technology.
Engis UK is exhibiting at the Optatec in Frankfurt, Germany, for the first time this year, offering visitors information and assistance on optics material polishing with superabrasives, together with the opportunity to discuss their specific processing challenges Engis' extensive R and D activity into the polishing of ultra-hard materials including Silicon Carbide and Sapphire, which has led to considerable reductions in Sapphire processing times using composite plate technology and the unique CMP-D process
This article was originally published on Manufacturingtalk on 8 Jan 2001 at 8.00am (UK)
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As part of the world-wide Engis Corporation, Engis UK is able to provide customers with complete, integrated superabrasives solutions, including both consumables and equipment from the same manufacturer.
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