Product category:
Abrasive machining - manual and CNC machines
News Release from: Engis (UK) | Subject: Horizontal enhanced wafer grinding machine
Edited by the Manufacturingtalk Editorial
Team on 06 April 2007
Wafer grinding machine is easy to use
A horizontal enhanced wafer grinding machine is easy to operate for individual and small quantity wafer loads and offers improved functionality, such as centre-wheel coolant delivery.
Engis' enhanced wafer grinding machine, the EHG 170AV, is now available to UK customers This small footprint, horizontal grinder is particularly suitable for surface grinding advanced materials including, wafers and windows to the highest level of flatness
This article was originally published on Manufacturingtalk on 8 Jan 2001 at 8.00am (UK)
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The launch of the EHG 170AV demonstrates Engis' commitment to develop technology specifically for customers in the advanced materials processing market, to which it brings its unrivalled expertise in superabrasive and lapping technologies.
Developed from the very successful, earlier EHG-150AV, the newly designed and technically enhanced machine remains a competitively priced and easy to operate horizontal grinder for individual and small quantity wafer loads, but offers improved functionality including centre-wheel coolant delivery to ensure optimal coolant dispersal, an updated operating system and an enlarged capacity cooling system.
Specification options include a coolant cooling unit, a cartridge filter and flow sensor and a magnetic or vacuum chuck.
The grinder offers automatic sizing and three-way motion to provide reduced surface and sub-surface damage and edge-chipping - providing an increased yield in operation.
* EHG-170AV Machine specifications are as follows.
Wheel speed - 4000 rev/min variable.
Work speed - 400 rev/min, 0.75kW, 200V 3-phase.
Maximum work size - 170mm.
Wheel motor - 1.5kW, 220V, 3-Phase.
Work motor - 0.75kW, 220V, 3-phase.
Wheel size - 170mm.
Dimensions - 1246mm x 650mm x 1260mm (WxDxL).
Weight - 1000kg net.
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