Product category:
Honing, polishing, burnishing and lapping
News Release from: Engis (UK) | Subject: Engis 432 lapping and polishing machine
Edited by the Manufacturingtalk Editorial
Team on 09 July 2008
Engis launches micro lapping/polishing
machine
Engis UK has launched its ultra-small footprint, four-way, double-sided lapping and polishing machine for short production runs in precision optic and small component manufacture.
Engis said that the Engis 432 ultra-small footprint, four-way, double-sided lapping and polishing machine is extremely flexible Using Engis diamond processing products it can be used to lap most precision optics and advanced materials, including sapphire, GaN and SiC
This article was originally published on Manufacturingtalk on 17 Jun 2008 at 8.00am (UK)
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The machine can be operated in unmanned mode, either 'timed' or 'thickness controlled', while still maintaining its accuracy and repeatability.
This small machine has a generous component envelope of 55mm diameter, with 18mm maximum thickness, making it capable of producing a wide range of precision components.
The small scale of the lapping surface gives a significant benefit in enabling the machine to lap and polish ultra-thin pieces that would be impossible on larger dual face machines.
Easy accessibility is provided by a manual lift-off top plate, simplifying the removal of components and minimising component breakage, contamination of the working zone and the subsequent need for cleaning down or pad replacement.
Engis UK managing director, John Wellings, said: "Our knowledge of the industry led us to realise that there was a real need for a machine of this size and capability as it satisfies a range of different user needs, in addition to volume production of small components, it can also be used to manufacture short runs which are not economically viable on large double sided machines, but too demanding to produce on single sided machines, as well as the manufacture of pre-production components".
Technical data is as follows.
* Lapping/polishing plate diameter - 195mm.
* Lapping/polishing track width - 60mm.
* Carriers - five no 32-tooth carriers.
* Maximum part thickness - 18mm.
* Maximum part diameter - 55mm.
* Variable speed with digital display - 0-100 rev/min (reversible).
* Digital cycle timer control - 0-99h.
* Automatic part thickness control - TESA read-out and probe.
* Operating voltage - 220/240V single phase.
* Dimensions - 430mm(W) x 6660mm(D) x 890mm(H).
* Estimated shipping weight - 70kg.
Optional equipment includes the following.
* Cast iron lap plates.
* Stainless steel polishing plates for pad polishing.
* Composite metal diamond polishing plates.
* Abrasive lapping slurry pump and agitation system.
* Peristaltic pump and stirrer system.
* Diamond dispensing system.
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