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Product category: Vision and scanning systems
News Release from: Exfo Electro-Optical Engineering | Subject: ProAlign 5000 component assembly workstation
Edited by the Manufacturingtalk Editorial Team on 18 September 2002

Bonding option for photonics assembly
system

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EXFO's new, fully integrated system for active alignment and assembly of photonics components now has a bonding option, ProBond

EXFO Electro-Optical Engineering has announced the availability of a bonding option, ProBond, for the ProAlign 5000 component assembly workstation The ProAlign 5000 workstation is EXFO's new, fully integrated system for active alignment and assembly of photonics components

The new option involves automatically dispensing a controlled amount of adhesive, then curing it with light.

ProBond was demonstrated for the first time on September 16, 2002 at the National Fiber-Optic Engineers Conference (NFOEC) in Dallas, Texas.

The ProAlign 5000/ProBond combination is the first system to ensure repeatability in the bonding and curing part of the component assembly process.

Non-repeatability is one of the main contributors to prolonged R and D phases and low-yield manufacturing.

The new bonding option increases repeatability which, in turn, shortens the R and D phase and increases yield and throughput, while providing for higher quality and performance of advanced optical components including planar lightwave circuits (PLCs), switches and transceivers.

"Research shows the lack of repeatability is a major contributor to low yield in the component assembly process.

To address this, we applied our expertise in UV curing technology to develop the ProBond accessory for the ProAlign 5000 component assembly workstation," said David Farrell, President of EXFO Burleigh Products Group, a wholly owned subsidiary of EXFO.

"Integrating ProBond with the ProAlign 5000 workstation automates the entire pigtail assembly process.

Developed primarily by the same design team that created the ProAlign 5000 workstation, ProBond raises the bar for cost-effective assembly automation and fast-track R and D.".

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