Harwin introduces surface mount shield clips

Harwin has introduced a range of surface mount EMI/RFI shield clips that reduce assembly time and simplify rework by eliminating secondary soldering operations.

Supplied in industry-standard tape and reel packaging, Harwin's RFI shield clips are positioned on the board and soldered using standard SMT placement equipment.

The shielding can is then pushed into place during final assembly.

As it is possible to remove and refit the can a number of times, adjustment and rework operations are simplified.

RFI clips are available in two sizes.

The larger Midi clip can handle cans with a wall thickness of 0.3mm and is available in beryllium copper and beryllium-free copper.

The smaller Mini version is only available in beryllium copper and suits cans with 0.13-0.23mm thick walls.

Harwin's EMI/RFI clips are targeted at telecommunications, data communications, data processing and in-car entertainment systems.

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