Wedge bonder claimed to be fastest, most flexible

For ribbon and wire bonding, Hesse and Knipps has introduced a high-speed, automatic wedge bonder offering flexibility for high-speed round wire and deep access ribbon and wire bonding.

Hesse and Knipps, a leading manufacturer of high-speed, fine pitch wedge bonders for the back-end semiconductor industry, has introduced the Bondjet BJ820.

It is a high-speed, automatic wedge bonder that offers the ultimate in flexibility for both high-speed round wire and deep access ribbon and wire bonding.

The company told manufacturingtalk that the Bondjet BJ820 handles all challenging fine pitch wire bonding applications in a single platform.

Jobs include RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive; using aluminum or gold wire or ribbon.

Claimed by Hesse and Knippsto be fastest wedge bonder on the market, the Bondjet BJ820 offers bond speeds up to 7 wires/s.

With axis repeatability of 1 micron at a balanced encoder resolution of 20nm, the Bondjet BJ820 provides increased process stability that enables reliable bonding of extremely small bond pads with a larger wire diameter.

A highly versatile 12in x 16.1in work area can serve as two or more smaller stations for efficient handling of smaller products or substrates.

Coupled with intelligent automation, parallel bond stations in one work area can eliminate significant indexing time, resulting in 60% greater throughput than competing machines.

"The Bondjet BJ820 offers very high repeatability for high volume production environments and a large control work area for both wire and ribbon bonding, offering greater throughput than competitive technology," said Joseph Bubel, president, Hesse and Knipps.

He added: "Combining its high bonding speeds, large work area and intelligent automation solutions, the wedge bonder offers the potential for the highest throughput on the market".

Other significant machine capabilities of the Bondjet BJ820 include the following.

* 12.5 micron to 85 micron diameter wire bonding.

* Ribbon bonding from 6 micron x 35 micron to 25 micron x 250 micron.

* Constant loop height and wire length.

* Maintains parallel loops within mixed reference system.

* Auto teach for linear applications, reducing programming time.

"The BONDJET BJ820 defines the benchmark in the industry by offering the fastest wiring speed, largest work area and greatest axis accuracy among its competition," summarized Bubel.

With a footprint of only 720 x 1250mm, the Bondjet BJ820 can be easily integrated into existing floor plan configurations or new concepts.

* About Hesse and Knipps - Hesse and Knipps Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly.

The company's automatic wedge bonders handle aluminum and gold wire in round and ribbon wire configurations with solutions for both light and heavy wire applications ranging from 12.5 micron (0.0005in) to 500 micron (0.020in) wire diameters.

The company's product line also includes dispensers and ultrasonic flip chip bonders, standard or customized indexers and handling systems, and process and manufacturing monitoring systems for interfacing with the company's equipment and commercial software packages.

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