Wire bonder introduced for solar panel market

Edited by the Manufacturingtalk editorial team Jul 28, 2008

Hesse and Knipps has introduced its BondJet 820 CPV wire bonder offering the fastest wiring speed, largest work area and greatest axis accuracy available for producing solar panel CPVs.

Hesse and Knipps said it will soon introduce a wire bonder dedicated producing CPV (concentrated photovoltaic) cells for the solar panel market.

The BondJet 820 CPV will offer all of the advanced features of the exisitng Bondjet BJ 820 wedge bonder, but with an extended table travel of 900mm x 350mm and expanded X-axis travel using intelligent automation.

Hesse and Knipps told manufacturingtalk that the BondJet BJ820 platform is an industry benchmark for wire bonding, offering the fastest wiring speed, largest work area and greatest axis accuracy available.

Other significant machine capabilities include the following.

* 12.5-85 micron diameter wire bonding.

* Ribbon bonding from 6 x 35 micron to 25 x 250 micron.

* Constant loop height and wire length.

* Maintains parallel loops within mixed reference system.

* Auto teach for linear applications, reducing programming time.

President of Hesse and Knipps in the USA, Joseph S Bubel, said: "The bonding speed and flexibility of the 820 platform, coupled with the extended bonding area, will lend itself very well to the CPV marketplace as well as other markets requiring such extended travels".

* About Hesse and Knipps - Hesse and Knipps Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly.

The company's automatic wedge bonders handle aluminum and gold wire in round and ribbon wire configurations with solutions for both light and heavy wire applications ranging from 12.5 micron (0.0005in) to 500 micron (0.020in) wire diameters.

The company's product line also includes dispensers and ultrasonic flip chip bonders, standard or customized indexers and handling systems, and process and manufacturing monitoring systems for interfacing with the company's equipment and commercial software packages.