Product category:
Adhesives and adhesive bonding equipment
News Release from: Inseto (UK) | Subject: Delo-Monopox MK096 adhesive
Edited by the Manufacturingtalk Editorial
Team on 20 April 2004
Adhesive fixes melves and SMD glass
components
Wave soldering and reflow processes are a special challenge for an adhesive that is used to fix SMD components on printed boards, unless that adhesive is especially formulated for the task.
Wave soldering and reflow processes are a special challenge for an adhesive that is used to fix SMD components on printed boards The reliability of many standard SMD adhesives decreases when used in conjunction with special forms, i.e barrel-shaped melves, and critical materials such as glass
This article was originally published on Manufacturingtalk on 20 Apr 2004 at 8.00am (UK)
Related stories
Solder reflow cure ovens are energy efficient
A range of energy efficient, solder reflow and cure ovens feature small footprint, low power consumption, low running costs and efficient filtration systems.
UV cured adhesives offer excellent stability
Ultra violet light cured adhesives for glass products offer excellent stability against ageing from sunlight and high transparency and are supplied with low, medium or high viscosity.
Delo have developed and tested an adhesive specifically for these requirements.
Together with renowned electronic customers, Delo have developed a new adhesive that ensures the reliable fixation of critical SMD components during wave soldering or reflow processes.
Delo-Monopox MK096 is a heat-cured, 1-part epoxy resin - optimised for high-speed processes as well as manual processing.
This adhesive is able to achieve a very high adhesion extremely quickly, especially on melves and glass substrates.
Within 60 seconds, it has a shear strength of 25N.
And after 3 minutes, when comparable products have reached approx.
10N, Delo-Monopox MK096 has a final shear strength of 70N.
In production this not only means that the cycle times are shorter, but also that the reject rates are significantly lower and less manual rework is required.
Due to the barrel-shaped geometry of the melves, there is only a small surface area available to bond.
Consequently, many standard SMD adhesives do not achieve the required strength for the subsequent soldering process.
This is where the new Delo adhesive displays its technical performance, which results in the significant reduction of reject rates.
Delo-Monopox MK096 can be easily processed on standard systems, e.g Camalot or Asymtek, and integrated into automatic processing.
The adhesive can be jetted, dispensed from a cartridge or applied by screen printing.
The red colouring of the adhesive makes visual control of the application easier.
The adhesive drops on the printed board are reproducible and firm - even during jetting, because the viscosity of the adhesive has been specially adjusted.
Over 30,000 drops per hour can be dispensed.
The applied adhesive shows a universal adherence on different types of substrates.
This makes it a good all rounder in the manufacture of printed boards.
• Inseto (UK): contact details and other news
• Email this article to a colleague
• Register for the free Manufacturingtalk email newsletter
• Manufacturingtalk Home Page
Search the Pro-Talk network of sites
