Product category:
Electrical systems
News Release from: International Rectifier | Subject: Chipset
Edited by the Manufacturingtalk Editorial
Team on 13 June 2007
Chipsets for a complete CPU power
solution
International Rectifier has introduced the IR3500 Control IC and IR3505 Phase IC chipsets which reduce external part counts by 25 percent and shrink powertrain footprints by 45 percent.
International Rectifier has expanded its XPhase family of scalable multiphase converter chipsets with the introduction of the IR3500 Control IC and IR3505 Phase IC The XPhase chipset provides a full-featured and flexible way to implement a complete Intel or AMD CPU power solution, and with simple six-bit voltage programming, the IR3500 is easily configured for use in general purpose, multiphase applications
This article was originally published on Manufacturingtalk on 15 Jan 2007 at 8.00am (UK)
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The latest XPhase chipset reduces external component count by 25 percent, which combined with a higher switching frequency, reduces the powertrain area by 45 percent in a five-phase design compared to previous generation technology.
The solution features the IRF6622 and IRF6628 DirectFET power MOSFETs to achieve a two percent efficiency improvement compared to competing solutions.
The XPhase chipset features programmable dynamic voltage identification (VID) slew rate, programmable VID offset and load line output impedance, hiccup over-current protection with delay to prevent false triggering, and simplified power good output to indicate correct operation and prevent false triggering.
XPhase is IR's distributed multiphase architecture that consists of control ICs and phase ICs that communicate using a simple six-wire bus scheme.
Phases can be added or removed without changing the fundamental design.
The six-wire bus consists of a three-wire digital phase timing bus, an average current, an error amplifier output and a VID voltage.
By eliminating point-to-point wiring between the control and the phase ICs, the six-wire bus shortens interconnections, and reduces parasitic inductance and noise.
This simplifies PCB layout and provides a more robust design.
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