Product category:
Electronics manufacturing: equipment, automation, software
News Release from: JBC Industrias | Subject: JBC Advanced soldering system
Edited by the Manufacturingtalk Editorial
Team on 17 October 2002
Soldering at lower temperature ups
efficiency
A microprocessor driven heating system provides very fast heat recovery so that soldering systems can operate at lower temperatures than previously possible.
Soldering specialist JBC has developed a microprocessor driven heating system that provides very fast heat recovery so that soldering systems can operate at lower temperatures than previously possible Not only does this provide faster soldering but also the system is kinder to circuit boards and components and also extends tip life thus significantly reducing operating costs
This article was originally published on Manufacturingtalk on 27 Sep 2002 at 8.00am (UK)
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The JBC Advanced system is said to give an 80 percent improvement over the performance of conventional soldering tools.
For instance while a conventional station can take between 10 and 90 seconds to reach 350 deg C any Advanced station with the company's 2210 hand piece can reach this temperature in only two seconds.
The heating system used achieves a high heating power in a very small cartridge, which means that the mass to be heated is small and therefore the thermal inertia is minimal.
In tests measuring the time taken to perform a series of five solder joints the Advance station completed the task in only eight seconds with a temperature drop of just 30 deg C - a conventional system took twice this time, 16 seconds, and suffered a temperature drop of 70 deg C.
Tip life can be up to five times longer than usual because as soon as the soldering iron is left on its stand the tip temperature automatically drops to 250 deg C, decreasing the wear on the tip.
When the soldering iron is taken out of the stand the soldering temperature is rapidly recovered because of the s cartridge's small mass.
Fast recovery also means that soldering can takes place at much lower temperatures with a maximum of 370 deg C, instead of the more common 450 deg C, eliminating the risk of damage to components since there is no excessive heat.
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