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Product category: Plating and plating systems
News Release from: Kebaili Corporation | Subject: Pulse generator for nano-electrodeposition
Edited by the Manufacturingtalk Editorial Team on 02 April 2007

Pulse generator used in
nano-electrodeposition

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A compact current pulse generator for use in electrodeposition applications in MEMS and nanotechnology, such as DC plating, pulse plating, and periodic reverse pulse plating.

Kebaili Corporation a leading California based high-tech company has released its CPG-500 Series - the industry first compact current pulse generator, specifically designed for electrodeposition applications, such as (direct current) DC plating, pulse plating, and periodic reverse pulse plating for a variety of applications in MEMS and nanotechnology According to Dr Mo Kebaili, chief technology officer of Kebaili Corporation, commercially available reverse pulse plating systems and potentiostat/galvanostat are typically large and usually not optimized for cleanroom environments

The CPG-500 was ergonomically designed in a compact unit, and optimized for end-user applications in MEMS and nanotechnologies.

The CPG-500 power requirement is 100-240V AC at 50-60Hz, is microprocessor-controlled, is fully user programmable, and is self-contained with no need to connect to a PC.

The CPG-500 is very user friendly, it can be programmed for DC plating, pulse plating, or reverse pulse plating.

CPG-500 can generate forward and reverse current pulses from 1 microA to 350 milliA, with a minimum pulse width of 1ms.

The compliance voltage is +/-10V.

The user can program 10 pulse waveforms and store the recipes in the CPG-500 internal non-volatile memory.

Kebaili CPG-500 offers impressive specifications, and is cost-effective for a wide range of research and development applications, and laboratory requirements, such as the following.

* - Reducing porosity and intrinsic stress, improving uniformity, increasing hardness and decreasing grain size of electroplated thin-films for physical, chemical, biological transducers and microsensors.

* - Silicon wafer through holes void free metallization of high aspect ratio microvias in microelectronic and microtechnology applications.

* - Metallic and alloy nanowires synthesis by electroplating through anodized aluminum templates in nanotechnology applications.

* - Micro-molds, micro-coils and metallic microstructures fabrication.

* - Electrodes fabrication for thin-film-based micro-batteries.

* - Micro-metallization in microfluidic devices and high aspect ratio micro-channel in biochip applications.

* - Platinum catalyst electrodeposition on polymeric exchange membrane (PEM) in micro fuel cell applications.

* - Microstructures fabrication for micro analytical instruments, and micro chemical plants.

* - Electrochemical deposition of bismuth telluride thin-films for micro-thermo electric cooling applications.

* - Electrodeposition of cobalt in anodized aluminum template as a precursor catalyst for carbon nanotubes synthesis by chemical vapor deposition (CVD).

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