http://www.manufacturingtalk.com/news/kul/kul000.html Kulicke and Soffa Industries news releases on Manufacturingtalk en-gb Copyright (C)2008 Pro-Talk Ltd. All rights reserved. Sat, 25 Oct 2008 08:00:00 UT Sat, 25 Oct 2008 08:00:00 UT http://www.pro-talk.com/images/protalklogo90.gif http://www.pro-talk.com/ 90 79 Kulicke and Soffa Industries has introduced the MaxSoft copper bonding wire that reduces IC bond pad sStress, and significantly improves second bond strength. Tue, 01 May 2007 08:00:00 UT Kulicke and Soffa Industries http://www.manufacturingtalk.com/news/kul/kul102.html Kulicke and Soffa Industries has introduced two die bonders: the Easyline E8202 for greater speed and throughput, and the Easyline E8202P for high precision +/-25um accuracy die bonding. Thu, 26 Apr 2007 08:00:00 UT Kulicke and Soffa Industries http://www.manufacturingtalk.com/news/kul/kul101.html Copper capillary supports highly consistent and stable fine wire 2nd bonds, while maintaining the quality of the overall wire bonding process. Fri, 15 Dec 2006 08:00:00 UT Kulicke and Soffa Industries http://www.manufacturingtalk.com/news/kul/kul100.html