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Die bonders for speed and high precision
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Kulicke and Soffa Industries product story
Edited by the Manufacturingtalk editorial team
Apr 26, 2007
Kulicke and Soffa Industries has introduced two die bonders: the Easyline E8202 for greater speed and throughput, and the Easyline E8202P for high precision +/-25um accuracy die bonding.
Kulicke and Soffa Industries has introduced two die bonders - the EasylineE8202 and E8202P - as the next generation of Alphasem Die Bonders.
Engineered for greater productivity and performance, the Easyline E8202 offers greater speeds and throughput while the Easyline E8202P provides high precision +/-25um accuracy die bonding.
KandS recently added the Alphasem family of dies bonders to its product portfolio through its recent acquisition of the company.
Based on Alphasem's highly successfully Easyline platform, both die bonders feature state-of-the-art technologies known to Alphasem customers such as a high-speed, air bearing pick-and-place system, fully automatic wafer handling system and a closed-loop linear motor pick tool that ensures unparalleled bond line thickness control and a non-piercing pick process.
Offering improved speed and throughput with accuracy of +/-38um, the Easyline E8202 Die Bonder is up to 30 percent faster than its predecessor - the E8032.
Capable of +/-25um placement accuracy, the Easyline E8202P also provides greater precision with accuracy improved from +/-38um to +/-25um.
Both machines also incorporate maintenance-free air bearing technology for uptime higher than 97 percent in addition to top throughput per floor space with up to 11,500 cycles per hour.
Simplified set-up with a graphical user interface in English and Chinese and fast product changeover typically within five minutes emphasize the Easyline die bonders ease of use.
Christian Rheault, KandS Vice President, Equipment Segment states, " We've moved quickly with our Alphasem Engineering staff in bringing newer die attach technology to the marketplace.
The new Easyline E8202 and E8202P represent the first step in launching more accurate and faster die bonders.
Our customers can look forward to a totally new generation products to come from us over the next year".
Both new die bonders will be available to the market in May 2007.
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