Product category:
Laser-based systems
News Release from: Panasonic Electric Works UK | Subject: SUNX HL-C1 Laser Measurement system
Edited by the Manufacturingtalk Editorial
Team on 08 July 2002
Laser displacement sensor measures
problem surface
Laser measurement system uses charged coupled device technology to quickly and precisely inspect surfaces that have posed problems for analogue based non-contact measurement equipment.
Matsushita Electric Works has enhanced its range of measurement sensors by introducing the new SUNX HL-C1 Laser Measurement system Using charged coupled device (CCD) based technology, the sensor is able to quickly and precisely inspect surfaces that have historically posed problems for analogue based non-contact measurement equipment
This article was originally published on Manufacturingtalk on 25 Jun 2001 at 8.00am (UK)
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Black rubber and specular objects, including glass and wafers, can now be reliably and accurately measured using the new SUNX HL-C1 laser based measurement system.
Suitable applications for the HL-C1 series include measurement of the eccentricity of steel shafts, co-planarity of IC pins, thickness measurement of brake discs and tyre tread measurement.
Containing an extremely compact controller, the unit can accept the connection of up to two measurement sensor heads.
This allows thickness measurement to be carried out easily using built in calculation functions.
The sensor heads themselves are available in two styles: one for measurement of diffuse type surfaces, including black rubber and machined metal; and the other for specular objects such as glass and highly reflective surfaces.
Both styles offer two measurement ranges and are capable of measuring to accuracies of 1micron.
Configuration of the controller can be performed using either a compact touch screen console or PC based configuration software via the built in RS232C communications port.
This port can also be used to transmit measurement data to a third party device, or the internal decision-making capability can be utilised and information accessed via digital I/O connections.
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