Product category:
Electronics manufacturing: quality control equipment, software
News Release from: Metryx | Subject: Non-destructive metrology tool
Edited by the Manufacturingtalk Editorial
Team on 28 July 2005
Metrology tool assesses wafer process
success
Utilising non-destructive measurement on production wafers, a metrology tool can directly assess from SPC methodology whether a process has been carried out successfully.
A high-throughput, simple-to-use, non-destructive metrology tool that offers atomic layer measurement accuracy has been developed by Metryx of Bristol, UK The Metryx Mentor OC23 tool is designed to measure material characterisation properties and quickly determine whether device manufacture process steps are operating correctly
This article was originally published on Manufacturingtalk on 13 Sep 2005 at 8.00am (UK)
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A manual, benchtop non-destructive R and D metrology tool that offers atomic layer measurement accuracy to 7 angstroms of oxide has been launched by Metryx.
Tool measures wafers to atomic levels
A non-destructive, nanotechnology weight metrology tool - to handle high volume production of 300mm semiconductor wafers - offers atomic layer measurement accuracy.
The unique Metryx technology allows process changes to be reliably and accurately determined after deposition, wet or dry etch or CMP processing.
Based on innovative nanotechnology weight measurement, the Metryx Mentor OC23 tool heralds a new generation in metrology.
Utilising non-destructive measurement on production wafers, the small footprint Metryx Mentor OC23 can directly assess if a process has been carried out successfully from Statistical Process Control (SPC) methodology.
Further reading
Tool offers atomic layer measurement accuracy
Metrology specialist, has unveiled an innovative nanotechnology weight metrology tool that offers atomic layer measurement accuracy and is designed to handle the demands of volume production.
Laser scanning microscope checks inside wafers
A confocal laser scanning microscope is designed for the non-destructive, high resolution observation of the interior of silicon wafers, IC chips, MEMS and other devices.
Capable of throughputs of 75 wafers per hour, nanotechnology weight measurement can be used on product, test and blanket wafers independent of substrate size or material.
Offering fully automatic cassette-cassette operation the Metryx Mentor OC23 uses industry standard 200 and 300mm open cassettes to allow measurements of the wafers before and after processing.
Control of ambient conditions within the measurement enclosure is fully automatic providing a weighing capability of <0.04mg which equates to approximately 0.7nm or rougly two atomic layers (1nm equals one thousand millionth of a metre).
The system is controlled via an SVGA Touchscreen with simple-to-use software.
Advanced automation software enables the tool to be fully integrated into any Fab Host Communications Network.
The system is capable of offering SPC of individual process steps as well as of the general manufacturing process.
The Metryx Mentor OC23 system combines accurate force measurement and advanced compensation software algorithms to improve weighing accuracy compared with previous techniques.
Almost any IC manufacturing process that results in a change in mass will benefit from this reliable tool, which has been achieving more than 95 percent uptime in advanced production environments.
"The Metryx Mentor OC23 can deal with many critical applications that other metrology systems cannot handle".
"The tool is sensitive enough to distinguish very subtle differences in process performance on product wafers and hence subsequent identification of manufacturing issues".
"This provides huge cost savings and increased profitability for our production customers," explained Dr Adrian Kiermasz, vice president, Business Development of Metryx.
The Metryx Mentor OC23 is the first in a series of nanotechnology weight metrology products specifically designed for monitoring critical IC process steps in a variety of device applications, including memory and logic components.
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