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News Release from: Metryx
Edited by the Manufacturingtalk Editorial
Team on 05 October 2005
$4m nanotechnology metrology tools sold
Metryx has won orders for up to $4million for its revolutionary Mentor high-throughput, simple-to-use, non-destructive metrology tool that offers atomic layer measurement accuracy.
Innovative metrology equipment specialist, Metryx, has won orders for up to $4million for the company's revolutionary Mentor high-throughput, simple-to-use, non-destructive metrology tool that offers atomic layer measurement accuracy Three Mentor SF3 systems capable of handling up to 60 wafers per hour have been shipped to two different wafer fab sites in Germany and the USA
This article was originally published on Manufacturingtalk on 13 Sep 2005 at 8.00am (UK)
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Atomic layer measurement accuracy for R and D
A manual, benchtop non-destructive R and D metrology tool that offers atomic layer measurement accuracy to 7 angstroms of oxide has been launched by Metryx.
Tool measures wafers to atomic levels
A non-destructive, nanotechnology weight metrology tool - to handle high volume production of 300mm semiconductor wafers - offers atomic layer measurement accuracy.
A further three Mentor DF3 systems capable of handling up to 70 wafers per hour have been shipped to two different sites in Taiwan.
All the Mentor systems are being used as metrology systems for process control applications during DRAM manufacture.
"The Metryx Mentor technology has now been endorsed by a number of major 200mm and 300mm wafer fabs worldwide".
"Leading semiconductor device manufacturers have utilised Mentor's innovative 'nanotechnology weight measurement' technique by installing multiple units, running critical applications in fully automated production environments".
"Weight metrology has proven to be both reliable and cost effective, providing yield improvements and reduced scrap," explained Dr Adrian Kiermasz, vice president, business development of Metryx".
""The key advantages of the Mentor system include its high throughput, low cost of ownership, independency of substrate, wafer size, wafer type and material".
"The measurement technique is also non-destructive and compatible with product, test and blanket wafers." Following on from the success of the Metryx Mentor system, the company has also recently introduced the Metryx Monitor metrology tool, which has been developed specifically for low volume R and D work in MEMS devices and semiconductors.
The Metryx Monitor system allows substrates to be manually loaded, removing the sophistication of automatic loading, offering considerable cost reduction, while retaining the accuracy and measurement capability to atomic layer differentiation.
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