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Product category: Non-contact, Optical and Laser
News Release from: Moritex Europe | Subject: HR65D-VI series of Machine Micro Lenses
Edited by the Manufacturingtalk Editorial Team on 28 November 2007

High-resolution lenses aid part
inspection

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High-resolution telecentric lenses have been designed for high-resolution discrete part inspection in semiconductor manufacturing operations.

The HR65D-VI series of Machine Micro Lenses (MMLs) from Moritex has been designed for high-resolution discrete part inspection in semiconductor manufacturing operations Operations include die bonding, flip chip bonding, chip on glass and chip on film machining

The C-mounted HR65D-VI series of MMLs are optimised for Mega pixel cameras up to 2/3in CCD chip size.

Each HR65D-VI series lens includes a variable iris providing the user with the flexibility of adjusting and setting the depth of field.

Incorporating integral coaxial telecentric lighting the HR65D-VI series MMLs provide high resolution (3-13 micron according to the Camera pixel pitch) and high uniformity of illumination across the entire field of view.

These features when combined with low distortion, high contrast and a long working distance, make the HR65D-VI series a valuable addition to any manufacturer looking to implement high resolution discrete part inspection.

Moritex MML's are telecentric lenses, which maintain a constant view angle to the subject.

This is achieved by keeping the optical ray paths parallel to each other.

Lens telecentricity is crucial in vision and inspection applications, said Moritex to manufacturingtalk.com, where view angle and magnification errors need to be minimised.

All Moritex MMLs are packaged in compact, low mass designs, assembled to endure the rigours of even the most demanding machine vision and industrial inspection applications.

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