Product category:
Electronics manufacturing: equipment, automation, software
News Release from: Master Bond | Subject: EP30FL epoxy potting and encapsulation compound
Edited by the Manufacturingtalk Editorial
Team on 26 October 2004
Low viscosity potting compound is
flexible
A new flexible, tough epoxy potting and encapsulation compound has extraordinarily low viscosity and is easy to apply. It can be used in thick and thin cross sections.
A new flexible, tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond, Hackensack, NJ, USA Master Bond EP30FL has extraordinarily low viscosity and is easy to apply
This article was originally published on Manufacturingtalk on 18 Jun 2008 at 8.00am (UK)
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Adhesive cures very quickly at room temperature
Master Bond has developed an exceptionally fast curing two component epoxy adhesive for general purpose bonding and develops high bond strength exceeding 140kg/cm2 at room temperature.
It can be used in both thick and thin cross sections.
This compound is 100% reactive and does not contain any volatiles.
It generates low exotherm during cure even though it cures relatively quickly at room temperature.
Shrinkage upon cure is exceptionally low.
Master Bond EP30FL has excellent adhesion to both similar and dissimilar substrates.
Because of its flexibility it is particularly recommended for use in environments exposed to thermal cycling.
Additionally it can withstand mechanical shock and vibration.
The hardened compound has superior electrical insulation properties and resistance to water.
Master Bond EP30FL is available in 1/2 pint, pint, quart, gallon and 5 gallon pail kits. Request a free brochure from Master Bond ...
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