Product category:
Adhesives and adhesive bonding equipment
News Release from: Master Bond | Subject: EP21TDC-4 two part epoxy
Edited by the Manufacturingtalk Editorial
Team on 16 December 2004
Room temperature curing epoxy has high
strength
Highly flexible two part epoxy has been developed for bonding, sealing and coating applications and is formulated to cure at ambient temperatures or elevated temperatures.
Highly flexible two part epoxy Master Bond EP21TDC-4 has been developed by Master Bond, Hackensack, N.J for bonding, sealing and coating applications
This article was originally published on Manufacturingtalk on 18 Jun 2008 at 8.00am (UK)
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Adhesive cures very quickly at room temperature
Master Bond has developed an exceptionally fast curing two component epoxy adhesive for general purpose bonding and develops high bond strength exceeding 140kg/cm2 at room temperature.
EP21TDC-4 is formulated to cure at ambient temperatures or more quickly at elevated temperatures.
It has a high peel strength of >30 pli and an elongation of over 300%.
Bonds have excellent resistance to vibration, impact and shock.
Master Bond EP21TDC-4 is 100% reactive and no solvents or diluents are emitted during cure.
Bond strength between similar and dissimilar substrates is exceptional.
It is particularly recommended for adhesion to natural rubber, neoprene, nitride and SBR rubber compounds without time consuming surface preparation procedures.
This system has a 1 to 4 mix ratio by weight and is available in premeasured kits and applicators.
EP21TDC-4 can be used over the wide temperature range of -100 deg F to +250 deg F.
It has superior resistance to fuels, water, oils and many chemicals.
It can even be cured underwater! The cured system has excellent electrical insulation properties. Request a free brochure from Master Bond ...
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