Epoxy adhesive has no solvents or volatiles

Two component, room temperature curing epoxy adhesive is easy to use, is 100% reactive, contains no solvents or volatiles and bonds well to both similar and dissimilar substrates.

Master Bond, Hackensack, NJ, USA, is proud to announce the development of a new two component, room temperature curing epoxy adhesive called EP21HT.

This system is easy to use and has a convenient, forgiving 1 to 1 mix ratio, weight or volume.

EP21HT is 100% reactive and contains no solvents or volatiles.

It has excellent physical strength properties and bonds well to both similar and dissimilar substrates.

These include metals, glass, ceramics, wood, rubbers and many plastics.

EP21HT has a service operating temperature range of -60 deg F to 400 deg F.

Cured EP21HT possesses superb electrical insulation properties.

It has a volume resistivity of >1014 ohm-cm.

It is also capable of withstanding exposure to thermal cycling and many chemicals including water, oils, fuels, acids, bases and salts.

It has a Shore D hardness of >70 and coefficient of thermal expansion of 50in/in x 10-6/ deg C.

It has a tensile strength of >8,000 lb/in2 and a tensile modulus of >350,000 lb/in2.

Master Bond EP21HT fully meets the requirements of MIL-A-81236 (OS) and MMM-A-187B.

In addition it conforms to Title 21, U.S.

Code of Federal Regulations, FDA, Chapter 1, Section 175.105 and 175.300 for food compatibility.

EP21HT is available for purchase in pint, quart, gallon and 5 gallon container kits.

For ease of usage it is also available in convenient syringe and gun applicators.

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