Product category:
Adhesives and adhesive bonding equipment
News Release from: Master Bond | Subject: EP21TPFL-1 sealing and casting compound
Edited by the Manufacturingtalk Editorial
Team on 04 May 2005
Compound resists fuels and chemicals
A two component, low viscosity, highly flexible bonding, sealing and casting compound offers outstanding resistance to fuels, water, and many aggressive chemicals.
Master Bond, Hackensack, New jersey, USA, has introduced EP21TPFL-1, a new two component, low viscosity, highly flexible bonding, sealing and casting compound Master Bond EP21TPFL-1 offers outstanding resistance to fuels, water, and many aggressive chemicals
This article was originally published on Manufacturingtalk on 18 Jun 2008 at 8.00am (UK)
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Adhesive cures very quickly at room temperature
Master Bond has developed an exceptionally fast curing two component epoxy adhesive for general purpose bonding and develops high bond strength exceeding 140kg/cm2 at room temperature.
It is formulated to cure at room temperature or more quickly at elevated temperatures.
This compound is 100% reactive and does not emit any volatiles during curing.
High performance EP21TPFL-1 has excellent physical strength properties and long term durability.
These properties are maintained even after long term exposure to hostile environmental conditions.
It has a service operating temperature range of -65 deg F to +300 deg F.
Strength and flexibility characteristics compare favorably with those of other elastomers such as silicones and urethanes.
EP21TPFL-1 is designed to resist thermal and mechanical shock.
It has superior electrical insulation properties.
EP21TPFL-1 is available in 1/2 pint, pint, quart, gallon and 5 gallon kits.
It is also available in low and high viscosity versions. Request a free brochure from Master Bond ...
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