Product category:
Adhesives and adhesive bonding equipment
News Release from: Master Bond | Subject: EP19HTFL single component, no-mix epoxy resin
Edited by the Manufacturingtalk Editorial
Team on 28 June 2005
One component,epoxy resin system is
tough
A single component, no-mix epoxy resin system for high performance bonding, sealing and impregnation applications has 'unlimited' working life at room temperature.
Master Bond, Hackensack, New Jersey, USA, has developed a new single component, no-mix epoxy resin system called EP19HTFL for high performance bonding, sealing and impregnation applications EP19HTFL is designed to have 'unlimited' working life at room temperature as it cures readily at elevated temperatures to a tough, strong and chemically resistant thermoset plastics
This article was originally published on Manufacturingtalk on 18 Jun 2008 at 8.00am (UK)
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Adhesive cures very quickly at room temperature
Master Bond has developed an exceptionally fast curing two component epoxy adhesive for general purpose bonding and develops high bond strength exceeding 140kg/cm2 at room temperature.
Recommended cure is at 1-2h at 300 deg F (150 deg C).
The higher the temperature the faster the cure speed.
The minimum cure temperature is 250 deg F.
EP19HTFL is 100% reactive and does not contain any solvents or diluents.
It exhibits high physical strength properties and has low shrinkage upon cure.
It has a tensile strength of 8,500 lb/in2.
EP19HTFL can be used over the wide temperature range of -60 deg F to +350 deg F.
It can also withstand thermal cycling and exposure to water, inorganic acids, bases, salts and organic solvents.
EP19HTFL has a viscosity of 500-600 cps and is easy to apply.
Low viscosity facilitates its use for impregnation applications.
It is available in pint, quart, gallon and 5 gallon containers.
It has a storage stability of 4 months at 75 deg F. Request a free brochure from Master Bond ...
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