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MB514 adhesive eliminates pretreatment stage

A Master Bond product story
Edited by the Manufacturingtalk editorial team May 21, 2009

Master Bond has announced that its MB514 polyethylene adhesive solves many of the bonding challenges presented by non-polar and low-energy polyolefin surfaces.

Typically, a pretreatment stage, which may include flame treatment, etching or roughening, is required before being able to bond polyolefin substrates.

MB514 has been formulated to eliminate this time-consuming stage.

The polyolefin-based hot melt is particularly suited for use on untreated surfaces of polyethylene, polypropylene and combinations of these substrates.

The only required processing steps are melting these compositions and then applying the molten hot melt to the surfaces to be bonded.

Good bond performance is retained over a temperature range of -29C to 88C.

MB514 adhesive is VOC free as it is comprised of 100 per cent solids and contains no solvents.

Bond strengths develop rapidly with no need for clamps or post-cure during assembly.

Master Bond said one of the main advantages of this polyethylene adhesive is the rapid speed of cure, which makes it ideal for high-speed assembly operations as the bonds are formed immediately upon cooling.

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