Product category:
CAD solid modelling software
News Release from: Missler Software | Subject: TopSolid
Edited by the Manufacturingtalk Editorial
Team on 25 December 2006
Shanghai University equipped with
TopSolid
Missler Software has recently signed an agreement to supply the Shanghai University of Engineering Science with the TopSolid integrated CAD/CAM solution.
Missler Software has recently signed an agreement to supply the Shanghai University of Engineering Science with the TopSolid integrated CAD/CAM solution The university has just started to use 40 TopSolid licences since the official agreement was made at the beginning of December
This collaboration is part of Missler Software's commitment to the Shanghai Vocational Training Directive centre, a body which assists in the promotion of advanced technologies for local Chinese industry.
This agreement comes one year after the creation of Missler Software's offices at Shanghai.
Missler Software China now has 4 offices throughout China in Beijing, Shanghai, Shenzhen and Xian.
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