Product category:
Micro- and nano-machining
News Release from: Oxford Lasers | Subject: Micro-machining systems
Edited by the Manufacturingtalk Editorial
Team on 22 May 2002
Lasers micro-machine MEMS and MEOMS
components
Micro-machining systems can cut, drill and etch precise micro-features quickly and cleanly into a wide range of materials used in MEMS and MEOMS applications.
Oxford Lasers micro-machining systems can cut, drill and etch precise micro-features quickly and cleanly into a wide range of materials used in MEMS and MEOMS applications This facility provides MEMS designers with an additional degree of freedom when generating new devices such as pressure sensors, accelerometers, angular rate sensors, micro-machines, medical/healthcare and chemical sensors
This article was originally published on Manufacturingtalk on 11 Nov 2003 at 8.00am (UK)
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Batch production of features typically from 200 microns down to only a few microns in material <1mm thick can be done with high speed lasers, from a few parts/month to 1000s/week.
The application of MEMS and MEOMS is huge, diverse and constantly growing, and the use of lasers in this field is following the same trend.
The combination of silicon based microelectronics with the latest in micro-machining technology promises to spread, and transform almost every product category.
Oxford Lasers high speed, reliable, accurate, round-the-clock production process equipment is ready to meet that demand.
As a result of market downturns in the semiconductor and electronics industry over the past year, many companies are looking to outsource parts of their manufacturing procedures.
Oxford Lasers has increased its sub-contracting capability and now has a set of dedicated, fully equipped, laser Applications Laboratories that are ideal for batch fabrication or technique development and testing.
There is even a special UV laser laboratory for work with plastics, polymers and glass.
Oxford Lasers micro-machining systems can also be used for trimming MEMS devices in order to ensure 100% QA.
For example, precise mass removal by laser ablation enables electro-mechanical trimming and balancing of angular rate sensor devices for higher yield.
In addition to processing silicon, generally associated with the electronics industry, these laser micro-machining systems can deal equally well with other difficult materials such as metals, diamond, ceramics and polymers.
Oxford Lasers has had many years of experience in developing bespoke processes and systems for demanding applications.
These systems benefit from an extensive range of lasers, motion control, part-handling and probing technology.
Further information can be found by contacting our team of Applications Engineers.
(This was Manufacturingtalk's Top Story on 21 May 2002).
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