Product category:
Manufacturing IT hardware
News Release from: Orbit Micro | Subject: 3U passive heatsink
Edited by the Manufacturingtalk Editorial
Team on 09 December 2005
Passive Heat Sink for Intel Xeon Potomac
Processor
Orbit Micro has announced the availability of a new high performance 3U passive heatsink for Intel Xeon Grandford/Potomac MP and Nocona DP Processors.
Orbit Micro an industrial and server systems integrator, announced the availability of a new high performance 3U passive heatsink for Intel Xeon Grandford/Potomac MP and Nocona DP Processors Orbit Micro's solution for Intel Xeon Potomac MP and Nocona DP processors is designed specifically for thermal and system engineers who require a high performance solutions for multiprocessor 3U servers, or for whisper quiet high performance workstations
This article was originally published on Manufacturingtalk on 21 Nov 2005 at 8.00am (UK)
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Orbit Micro's high performance heat sink is designed to meet Intel recommendations for thermal performance.
In addition, the lightweight design is well below the maximum weight specifications of the Intel CEK retention system.
The high efficiency, low-pressure drop fin design provides the necessary cooling capacity to support processors thermal requirements up to 200 watts without the addition of expensive system blowers or additional fans.
The heat sink features a base consisting of an aluminum frame and copper center with six embedded heat pipes for superior heat transfer to the fins.
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