Product category:
Adhesives and adhesive bonding equipment
News Release from: Bondmaster | Subject: Bonding structural polypropylene parts
Edited by the Manufacturingtalk Editorial
Team on 29 May 2003
Structural bonding of polypropylene
parts viable
A technique for bonding low surface energy substrates such as polypropylene uses a combination of air-plasma surface treatment and a flexible epoxy adhesive.
Structural bonding of polypropylene parts now viable In a recently published paper a technique for bonding low surface energy substrates such as polypropylene was outlined using a combination of air-plasma surface treatment and a flexible epoxy adhesive The research work was presented to the ASC (Adhesive and Sealants Council) in St Louis, USA by Bondmaster's research technologist, Terry Gordon
This article was originally published on Manufacturingtalk on 2 Dec 2002 at 8.00am (UK)
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The paper was well received by conference delegates as the challenge of bonding polypropylene surfaces has long confounded designers and adhesives researchers alike.
The work described in the paper typifies the research underway at Bondmaster where a holistic view of the bonding process is taken in order to provide product designers with practical solutions to the demands they make upon adhesives, substrates and production processes.
The contents of the paper widens the choice of materials available for product designers and makes the way clear for improved product performance and increased process efficiency.
A copy of the paper can be obtained by contacting Bondmaster.
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