Product category:
Electronics manufacturing: equipment, automation, software
News Release from: Production Equipment Sales | Subject: Vacuum furnace soldering
Edited by the Manufacturingtalk Editorial
Team on 20 June 2005
Vacuum solder furnace effectiveness
improved
A number of developments to increase the effectiveness of vacuum soldering furnaces and facilitate lead-free soldering include a new atmosphere formulation, pastes and fluxes.
Nitrogen enriched with formic acid vapour atmosphere efficiently removes most oxides at rather low surface temperatures from 150 deg C to 200 deg C without leaving any residues or attacking sensitive optical surfaces This is also preformed on covered surfaces in a stacked assembly: substrate - pre-form -die
This article was originally published on Manufacturingtalk on 21 Feb 2000 at 8.00am (UK)
Related stories
Wider range of micro-abrasion equipment
Micro abrasion technology finds application in many specialist areas, especially those of dentistry, electronics, metalworking, conservation and etch working
Laser scanning microscope checks inside wafers
A confocal laser scanning microscope is designed for the non-destructive, high resolution observation of the interior of silicon wafers, IC chips, MEMS and other devices.
Wedge bonder claimed to be fastest, most flexible
For ribbon and wire bonding, Hesse and Knipps has introduced a high-speed, automatic wedge bonder offering flexibility for high-speed round wire and deep access ribbon and wire bonding.
Even the bottom of an oxidised copper coin placed on the heated plate is perfectly clean.
This system may also be used to aid in lead-free soldering.
* Solder paste/liquid flux capability - warped DBC processing - the purpose of this solder paste feature is to protect the process chamber and vacuum system from condensed flux.
This is accomplished by a low mass, easy to replace Al hood inserted on the chamber lid forming a second process chamber over the heated plate and by a flux filter system at the gas outlet.
Warped DBCs are placed in cavities of the hot plate.
A spring array in the lid applies uniform pressure on the DBC when the chamber is closed.
This ensures uniform heat transfer.
* Rapid Ramping - top side heater - direct heating/cooling - IR lamps with various power ratings are available to increase the installed heater power to match requested ramping and processing temperature requirements: maximum 50K/second up to 1100 deg C on a single 200mm wafer.
In addition IR lamps and cooling gas nozzles can be installed in the chamber lid for top side heating/cooling.
Low mass single wafer carriers, upto 300 mm multiple wafer graphite susceptors, and custom tailored substrate carriers for direct heating/cooling are available.
Applications include RTA/RTP, SiAu/AuGe alloying, BCB curing, wafer bump reflow, CSP and MEMS packaging.
• Production Equipment Sales: contact details and other news
• Email this article to a colleague
• Register for the free Manufacturingtalk email newsletter
• Manufacturingtalk Home Page
Search the Pro-Talk network of sites
