Packaging scolarships backed by institute

The Packaging Machinery Manufacturers Institute and Pack Expo exhibitors raised US$127,050 to provide packaging schools across the US and Canada with financial grants.

The Packaging Machinery Manufacturers Institute (PMMI) and Pack Expo exhibitors raised US$127,050 to support packaging education, surpassing the announced goal of US$100,000.

The campaign was designed to provide packaging schools across the US and Canada with financial grants.

PMMI created two Pack Expo Scholarship Funds to which companies and individuals could donate funds: Pack Expo Scholarship General Fund - Contributions to this fund were distributed evenly among schools that have a packaging curriculum focus and exhibit at Pack Expo.

The schools will be asked to name a student recipient.

This year, 19 packaging schools divided up US$107,050 in financial support, with US$35,000 being designated to 2-year technical schools through the Claude Breeden and C.

Glenn Davis Scholarship programs.

Three Platinum donors contributed to the General Scholarship Fund: MG America PMT Magazine WeighPack Systems Pack Expo Scholarship Designated Gift Fund - Companies or individuals who donated US$5,000 or more to the Pack Expo Scholarship effort were able to designate a specific school to which the funds they provided would be directed.

$20,000 was designated to specific schools from four sponsors companies.

The following schools received designated gifts: Virginia Polytechnic Institute - BluePrint Automation Univ of Wisconsin, Stout - Bosch Packaging Technology University of Illinois at Urbana - Morrison Container Handling Solutions Michigan State University - PPi Technologies "Working together, PMMI and the Pack Expo exhibitor community made a strong commitment to the future of the industry through financial aid," said Charles D Yuska, president and CEO, PMMI.

"Because of their support, hundreds of students will be able to further their education and become packaging professionals." PMMI underwrote all of the marketing and development efforts to ensure that 100% of the funds raised would be donated directly to schools to benefit students.

Pack Expo Scholarship recipients were announced and honoured at the Future Packaging Leaders luncheon at Pack Expo International in Chicago, Illinois on October 31, 2006.

Yuska opened the luncheon with a brief speech on the importance of funding education in the packaging industry and then a video presentation on Packaging as a career was shown.

Bruce Larson, vice president of sales at Goodman Packaging and PMMI's Education and Workforce Development Committee Chairman, honoured the contributing companies and distributed the funds.

Many of the over 600 packaging students who attended Pack Expo had the opportunity to meet and network with various industry leaders during the luncheon.

"Today's students are the source of innovative new ideas and fresh solutions which will help drive the continued success of the packaging machinery industry," added Yuska.

"With thousands of professionals, students, universities and technical schools supporting the show, Pack Expo was the perfect opportunity to recognise the next generation of leaders.".

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