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IO-Link integrated into PROFIBUS and PROFINET

A Profibus product story
Edited by the Manufacturingtalk editorial team May 19, 2008

Profibus and Profinet International has published documents concerning the integration of IO-Link into PROFIBUS and PROFINET to enable wider use of IO-Link.

PI (Profibus and Profinet International) has published documents on the integration of IO-Link into PROFIBUS and PROFINET.

Together with the existing physical layer and protocol specification, the integration specification forms the basis for the wider deployment of IO-Link in PROFIBUS and PROFINET systems, said PI.

The requirements for the development of products with IO-Link interface were laid out with the physical layer and protocol specification.

Since then, almost all relevant sensor manufacturers and a host of manufacturers of I/O modules have introduced IO-Link products to the market.

The publication of the integration documentation makes available the basis for open integration of IO-Link in PROFIBUS and PROFINET systems.

To illustrate this, PI set up a live application at their stand at the Hanover Fair 2008, with which the engineering of IO-Link products from various manufacturers was demonstrated.

The physical layer and protocol specification of IO-Link is fully independent of PROFIBUS and PROFINET, so IO-Link can be subordinated to all fieldbuses or Ethernet-based systems.

Only the integration takes place under the consideration of fieldbus-specific aspects.

Work to integrate IO-Link into additional fieldbus systems is already in preparation.

A suitable device description is of significant importance here, said PI.

The definition of an appropriate independent device description for IO-Link, IO Device Description (IODD), is already under review by PI.

IO-Link is gaining more and more support, said PI to manufacturingtalk.

The number of actively contributing companies in the IO-Link consortium has already surpassed 30.

In addition to manufactures of sensors and actuators, they include manufactures of I/O components, automation systems and semi-conductors.

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