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Manufacturing communication infrastructure
News Release from: RAD Data Communications | Subject: ToP solution
Edited by the Manufacturingtalk Editorial
Team on 30 January 2006
Joint offering of Pseudowire Solution
Circuit Emulation Technology to be Incorporated into New Line of TDM-over-Packet Chips.
A leading supplier of integrated circuits and a major manufacturer of telecommunications access solutions today announced that they have worked together to produce a new, unique line of chips for circuit emulation services over Next Generation Networks Maxim Integrated Products, one of the largest international suppliers of quality analog and mixed-signal products for applications that require real-world signal processing, and Dallas Semiconductor, its wholly-owned subsidiary, are working with RAD Data Communications to produce the TDM over Packet (ToP) chips
This article was originally published on Manufacturingtalk on 25 Jan 2006 at 8.00am (UK)
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RAD will develop a circuit emulation "core" based on its key technologies, to be incorporated by Dallas Semiconductor, alongside its own integrated T1/E1/J1 transceiver technologies, into the ToP chips.
The ToP solution will be the only TDM-over-Ethernet/IP/MPLS (ToP) family of devices to provide circuit emulation over PSN capability and the Dallas Semiconductor framer and line interface unit (LIU) in the same device.
With the industry's most robust clock-recovery engine onboard, this IC will provide full IETF PWE3 TDMoIP, SAToP, and CESoPSN draft compliance.
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The ToP devices will have low power consumption, offer a substantial cost reduction over the processor-based solutions, and be available in several pin-compatible, compact packages.
The RAD technologies to be incorporated into the chips are:.
* TDMoIP (TDM over IP) Pseudowire.
* Circuit Emulation Service over Packet Switched Networks.
* Structured Agnostic TDM over Packet.
The Dallas Semiconductor technologies integrated into the chips are:.
* Full-Featured, Integrated T1/E1/J1 Transceivers.
* Long-Haul/Short-Haul, Low-Power LIUs with On-Board Software-Selectable Termination.
"Our cooperation is based on a mutual recognition of each other's strengths in the industry," states Michael Smith, Managing Director of the Communications Business Unit at Dallas Semiconductor.
"This synergy maximizes the potential offered by the broad Maxim/Dallas Semiconductor customer base and RAD's pioneering expertise in developing legacy-over-packet pseudowire technologies." The two companies have long had a supplier/customer relationship.
"RAD has used Maxim/Dallas Semiconductor E1/T1 chips in a number of its access solutions," notes Hugo Silberman, RAD's Vice President of Research and Development.
"We are delighted, therefore, that our relationship has now become complementary," he adds.
"Maxim/Dallas Semiconductor is one of the largest silicon vendors in the world, and its choice of TDMoIP signals that this technology has truly come of age." The primary function of TDMoIP and similar pseudowire solutions is to emulate native services like ATM, Frame Relay, Ethernet, low-rate TDM, or SONET/SDH over a common packet-switched network.
This technology allows voice, video or data circuits to be extended across packet-switched networks easily, transparently, and economically.
In so doing, it protects investments in existing TDM and other legacy equipment, enabling a smooth migration to IP, Ethernet and MPLS networks.
"This is vitally important for service providers as well as their enterprise customers," explains Amir Karo, Associate Vice President of Marketing at RAD Data Communications.
"Service providers need to support legacy services over their new packet networks, since the discontinuation of a service might result in customer churn," he continues.
"At the same time, innovative solutions that transparently emulate these services over newly deployed PSNs such as Ethernet, IP and MPLS enable service providers and enterprise networks to save on Capex by utilizing as much of their existing infrastructure as possible." The circuit emulation core that RAD will develop for Dallas Semiconductor will fully comply with all the TDM-over-pseudowire standards of the ITU-T, IETF, MEF, and MFA Forum.
It will also offer additional features and enhancements.
Clock recovery will comply with G.823/824 jitter and wander requirements of the traffic and synchronization interfaces.
TDMoIP technology offers all the building blocks for networking scenarios.
These include pure Ethernet in the first mile, where TDM is delivered to a legacy network from the point-of-presence (POP); peer-to-peer leased lines over a packet network, a popular scenario in business parks; and delivering concentrated TDM traffic at the contact point between the Ethernet packet network and legacy backbone.
In addition, TDMoIP enables 2G and 2.5G backhaul traffic to be transported transparently over PSNs cost-effectively and without sacrificing any performance.
The ToP solution will incorporate Dallas Semiconductor's T/E Carrier technology, which encompasses full-featured and independently configurable, high-density framers and LIUs with support for both long- and short-haul lines.
These LIU and framer combinations offer software-selectable transmit- and receive-side termination internal to the chip, and user-defined waveforms and PRBS in both transmit and receive directions.
Combining the T/E Carrier transceiver with the ToP engine results in the most highly integrated and lowest power solution available on the market for extending T1/E1 services over the packet backbone.
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